Inventor

Yu-Ting Lin

Inventor

Tainan, TW

Overview

67→

Patents

2002–2020

Patent span

Electricity

Primary field (CPC H)

Patents· 67 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1015%

H10DInorganic electric semiconductor devices13%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1012%

H01LSemiconductor devices11%

C09DCoating compositions, e.g. paints, varnishes or lacquers6%

G06FElectric digital data processing5%

Y10TTechnical subjects covered by former us classification3%

C09BOrganic dyes or closely-related compounds for producing dyes, e.g. pigments3%

G02BOptical elements, systems or apparatus3%

G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein3%

PatentTitleYear

10,867,845Semiconductor device and method2020 10,846,262Data migration to a cloud computing system2020 10,804,097Conductive feature formation and structure2020 10,714,329Pre-clean for contacts2020 10,714,334Conductive feature formation and structure2020 10,685,842Selective formation of titanium silicide and titanium nitride by hydrogen gas control2020 10,588,932Method for promoting hair growth using banana stamen extract2020 10,522,631Contact silicide having a non-angular profile2019 10,510,851Low resistance contact method and structure2019 10,497,615Semiconductor device and method2019 10,468,530Semiconductor structure with source/drain multi-layer structure and method for forming the same2019 10,453,933Barrier layer for dielectric layers in semiconductor devices2019 10,391,476Inorganic nanofiber and method for manufacturing the same2019 10,332,789Semiconductor device with TiN adhesion layer for forming a contact plug2019 10,269,926Purging deposition tools to reduce oxygen and moisture in wafers2019 10,261,025Workpiece surface detection method and system using the same2019 10,216,744Data migration to a cloud computing system2019 10,157,785Semiconductor device and method2018 10,153,203Methods for forming metal layers in openings and apparatus for forming same2018 10,099,331Punching system2018 10,032,876Contact silicide having a non-angular profile2018 10,012,857Display apparatus including a prism module2018 9,893,185'Fin field effect transistor and method for fabricating the same'2018 9,613,465'Method for suturing 3D coordinate information and the device using the same'2017 9,612,468'Display apparatus'2017 9,508,548'Method for forming barrier layer for dielectric layers in semiconductor devices'2016 9,509,197'Manufacturing apparatus for a stator core'2016 9,423,912'Touch panel'2016 9,323,737'Generating an interactive page template based on setting a material type and a plurality of input and output signals for a mobile device'2016 9,300,942'Method and control system for three-dimensional video playback using visual fatigue estimation'2016 9,031,587'Mobile apparatus data sharing method, system for sharing data through mobile apparatus and computer readable storage medium storing the method'2015 9,021,427'Conversion methods of applications of mobile devices and mobile devices and systems using the same'2015 8,823,669'Touch panel, anti-noise unit and method for processing a noise'2014 8,730,195'Touch-sensitive device and touch-sensitive display device'2014 8,711,135'Driving system of display panel having a circuit of a voltage generator and driving method thereof'2014 8,704,966'Pixel array, active device array substrate and flat display panel'2014 8,680,635'CMOS image sensor big via bonding pad application for AICu process'2014 8,642,439'Semiconductor device and method of formation'2014 8,643,614'Touch-sensitive device and touch-sensitive display device'2014 8,628,998'Annealing methods for backside illumination image sensor chips'2014 8,580,657'Protecting sidewalls of semiconductor chips using insulation films'2013 8,502,335'CMOS image sensor big via bonding pad application for AlCu Process'2013 8,435,893'Semiconductor device and method of formation'2013 8,391,560'Method and system for image identification and identification result output'2013 8,391,559'Method and system for image identification and identification result output'2013 8,344,471'CMOS image sensor big via bonding pad application for AICu process'2013 8,304,988'Tandem organic light emitting device and method for assembling the same'2012 8,243,361'Electrophoretic display apparatus and method of manufacturing the same'2012 8,101,437'Method of forming three-terminal solar cell array'2012 7,939,824'Test structure'2011 7,498,680'Test structure'2009 7,439,751'Apparatus and method for testing conductive bumps'2008 7,201,610'Network device with power outputting socket'2007 7,180,173'Heat spreader ball grid array (HSBGA) design for low-k integrated circuits (IC)'2007 7,125,445'Red colorant composition and magenta inkjet ink composition with stable pH'2006 7,017,201'Table structure which can be converted into a bed'2006 6,964,702'Ink set for inkjet printers'2005 6,943,103'Methods for reducing flip chip stress'2005 6,899,753'Highly bleed-alleviating ink composition'2005 6,872,824'Pyrimidine spirobifluorene oligomer for organic light-emitting device'2005 6,814,790'Multicolor dye set and inkjet ink composition with high chroma'2004 6,793,722'Inkjet ink composition with high chroma'2004 6,793,721'Invisible ink composition and method to ensure document confidentiality'2004 6,783,581'Ink-jet ink comprising a glycol compound with grafts'2004 6,706,099'Fragrant ink with microcapsule compounds to provide fragrance'2004 6,669,766'Dye set and ink composition with high water-fastness'2003 6,342,398'Method of backside emission analysis for BGA packaged IC\'s'2002

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2002–2014Patents assigned to TAIWAN SEMICONDUCTOR MFG (12)· patent assignee history

2002–2018Based in Hsinchu, TW· patent location history

2003–2006Patents assigned to BENQ CORP (9)· patent assignee history

2004–2006Based in Lujou, TW· patent location history

2005–2019Based in Taichung, TW· patent location history

2006–2015Patents assigned to LIN YU-TING (17)· patent assignee history

2013–2019Patents assigned to IND TECH RES INST (5)· patent assignee history

2013–2020Based in Tainan, TW· patent location history

2014–2017Based in New Taipei, TW· patent location history

2016–2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (17)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
LIN YU-TINGself	17	2006–2015
TAIWAN SEMICONDUCTOR MFG CO LTD	17	2016–2020
TAIWAN SEMICONDUCTOR MFG	12	2002–2014
BENQ CORP	9	2003–2006
IND TECH RES INST	5	2013–2019

Locations

Location	Patents	Span
Tainan, TW	23	2013–2020
Hsinchu, TW	14	2002–2018
Lujou, TW	5	2004–2006
Taichung, TW	3	2005–2019
New Taipei, TW	3	2014–2017