Inventor

Michel Bruel

Inventor

Veurey Voroize, FR

Overview

1983–2020

Patent span

Electricity

Primary field (CPC H)

Patents· 68 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1028%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1022%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests11%

Y10TTechnical subjects covered by former us classification6%

C30BSingle-crystal growth3%

G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices3%

H01LSemiconductor devices3%

H10DInorganic electric semiconductor devices3%

H01JElectric discharge tubes or discharge lamps3%

G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure2%

PatentTitleYear

10,537,150Movement assistance device2020 9,564,496'Process for treating a substrate using a luminous flux of determined wavelength, and corresponding substrate'2017 9,528,196'Method and device for fabricating a layer in semiconductor material'2016 9,343,351'Process for transferring a layer'2016 9,196,490'Method and device for heating a layer of a plate by priming and light flow'2015 9,190,314'Process for treating a substrate using a luminous flux of determined wavelength, and corresponding substrate'2015 9,048,288'Method for treating a part made from a decomposable semiconductor material'2015 8,759,196'Method for preparing a substrate by implantation and irradiation'2014 8,609,514'Process for the transfer of a thin film comprising an inclusion creation step'2013 8,563,399'Detachable substrate and processes for fabricating and detaching such a substrate'2013 8,492,877'Semiconductor structure with smoothed surface and process for obtaining such a structure'2013 8,475,693'Methods of making substrate structures having a weakened intermediate layer'2013 8,470,712'Process for the transfer of a thin film comprising an inclusion creation step'2013 8,420,506'Process for cleaving a substrate'2013 8,324,530'Method for heating a wafer by means of a light flux'2012 8,101,503'Method of producing a thin layer of semiconductor material'2012 8,062,564'Method of producing a plate-shaped structure, in particular, from silicon, use of said method and plate-shaped structure thus produced, in particular from silicon'2011 7,883,994'Process for the transfer of a thin film'2011 7,846,816'Method for producing a multilayer structure comprising a separating layer'2010 7,498,234'Method of producing a thin layer of semiconductor material'2009 7,435,614'Method for treating a structure to obtain an internal space and structure having an internal space'2008 7,368,030'Intermediate suction support and its utilisation for producing a thin film structure'2008 7,332,030'Method of treating a part in order to alter at least one of the properties thereof'2008 7,300,853'Thin layer semi-conductor structure comprising a heat distribution layer'2007 7,229,899'Process for the transfer of a thin film'2007 RE039484'Process for the production of thin semiconductor material films'2007 7,067,396'Method of producing a thin layer of semiconductor material'2006 6,993,215'Optical switch with flexible insulated beam and method for making same'2006 6,946,365'Method for producing a thin film comprising introduction of gaseous species'2005 6,891,990'Optical device with integrated structure and wave deviation'2005 6,876,787'Device for transmitting an optical wave in a structure provided with an optical fiber and method for making same'2005 6,809,009'Method of producing a thin layer of semiconductor material'2004 6,808,967'Method for producing a buried layer of material in another material'2004 6,809,044'Method for making a thin film using pressurization'2004 6,756,286'Method for transferring a thin film comprising a step of generating inclusions'2004 6,730,208'Chip and method for fitting out a chip comprising a plurality of electrodes'2004 6,558,998'SOI type integrated circuit with a decoupling capacity and process for embodiment of such a circuit'2003 6,465,327'Method for producing a thin membrane and resulting structure with membrane'2002 6,362,077'Structure comprising a thin layer of material made up of conductive zones and insulating zones and a method of manufacturing such a structure'2002 6,335,258'Method for making a thin film on a support and resulting structure including an additional thinning stage before heat treatment causes micro-cavities to separate substrate element'2002 6,316,333'Method for obtaining a thin film in particular semiconductor, comprising a protected ion zone and involving an ion implantation'2001 6,303,468'Method for making a thin film of solid material'2001 6,261,928'Producing microstructures or nanostructures on a support'2001 6,225,190'Process for the separation of at least two elements of a structure in contact with one another by ion implantation'2001 6,225,192'Method of producing a thin layer of semiconductor material'2001 6,190,998'Method for achieving a thin film of solid material and applications of this method'2001 6,159,323'Process for selective transfer of a microstructure formed on an initial substrate to a final substrate'2000 6,103,597'Method of obtaining a thin film of semiconductor material'2000 6,059,877'Method for obtaining a wafer in semiconducting material of large dimensions and use of the resulting wafer for producing substrates of the semiconductor on insulator type'2000 6,020,252'Method of producing a thin layer of semiconductor material'2000 5,993,677'Process for transferring a thin film from an initial substrate onto a final substrate'1999 5,985,688'Method for inserting a gaseous phase in a sealed cavity by ion implantation'1999 5,863,830'Process for the production of a structure having a thin semiconductor film on a substrate'1999 5,804,086'Structure having cavities and process for producing such a structure'1998 5,714,395'Process for the manufacture of thin films of semiconductor material'1998 5,661,333'Substrate for integrated components comprising a thin film and an intermediate film'1997 5,559,043'Method for placing semiconductive plates on a support'1996 5,494,835'Process for the production of a relief structure on a semiconductor material support'1996 5,374,564'Process for the production of thin semiconductor material films'1994 4,704,302'Process for producing an insulating layer buried in a semiconductor substrate by ion implantation'1987 4,585,945'Process and apparatus for implanting particles in a solid'1986 4,564,763'Process and apparatus for varying the deflection of the path of a charged particle beam'1986 4,536,657'Process and apparatus for obtaining beams of particles with a spatially modulated density'1985 4,527,044'Apparatus for treating a sample by a pulsed electron beam'1985 4,508,056'Target holder with mechanical scanning'1985 4,452,644'Process for doping semiconductors'1984 4,370,176'Process for fast droping of semiconductors'1983 4,368,083'Process for doping semiconductors'1983

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1983–2013Patents assigned to COMMISSARIAT ENERGIE ATOMIQUE (46)· patent assignee history

1983–2020Based in Veurey Voroize, FR· patent location history

1998Based in Vevrey, FR· patent location history

2005–2006Patents assigned to OPSITECH OPTICAL SYS ON A CHIP (2)· patent assignee history

2007–2017Patents assigned to SOITEC SILICON ON INSULATOR (15)· patent assignee history

2008–2016Patents assigned to BRUEL MICHEL (15)· patent assignee history

2012–2013Patents assigned to ASPAR BERNARD (3)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
COMMISSARIAT ENERGIE ATOMIQUE	46	1983–2013
BRUEL MICHELself	15	2008–2016
SOITEC SILICON ON INSULATOR	15	2007–2017
ASPAR BERNARD	3	2012–2013
OPSITECH OPTICAL SYS ON A CHIP	2	2005–2006

Locations

Location	Patents	Span
Veurey Voroize, FR	67	1983–2020
Vevrey, FR	1	1998