Inventor

Qingyun Chen

Inventor
Branford, CT, US

Overview

19→
Patents
2005–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 19 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1023%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1023%
C23CCoating metallic material12%
C09DCoating compositions, e.g. paints, varnishes or lacquers9%
C25DProcesses for the electrolytic or electrophoretic production of coatings7%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems5%
H05KPrinted circuits5%
B01JChemical or physical processes, e.g. catalysis or colloid chemistry2%
B05DProcesses for applying fluent materials to surfaces, in general2%
C01BNon-metallic elements2%
PatentTitleYear
10,919,832Method for preparing low-grade unsaturated fatty acid ester2021D0898047Display screen or portion thereof with animated graphical user interface202010,732,685System and method for operating power converters20209,613,858'Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers'20179,537,416'System and method for operating power converters'20179,246,407'Voltage balancing system and method for multilevel converters'20168,771,495'Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers'20148,388,824'Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers'20137,998,859'Surface preparation process for damascene copper deposition'20117,968,455'Copper deposition for filling features in manufacture of microelectronic devices'20117,704,306'Manufacture of electroless cobalt deposition compositions for microelectronics applications'20107,615,491'Defectivity and process control of electroless deposition in microelectronics applications'20097,611,988'Defectivity and process control of electroless deposition in microelectronics applications'20097,611,987'Defectivity and process control of electroless deposition in microelectronics applications'20097,410,899'Defectivity and process control of electroless deposition in microelectronics applications'20087,393,781'Capping of metal interconnects in integrated circuit electronic devices'20087,332,193'Cobalt and nickel electroless plating in microelectronic devices'20087,268,074'Capping of metal interconnects in integrated circuit electronic devices'20076,859,606'ER3+ doped boro-tellurite glasses for 1.5 μm broadband amplification'2005

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2007–2017Patents assigned to ENTHONE (13)· patent assignee history
2007–2017Based in Branford, CT, US· patent location history
2013Patents assigned to CHEN QINGYUN (1)· patent assignee history
2016–2020Patents assigned to GEN ELECTRIC (3)· patent assignee history
2016Based in Munich, DE· patent location history
2017–2020Based in Bavaria, DE· patent location history
2020Patents assigned to BIBO NETWORK LLC (1)· patent assignee history
2020Based in Shanghai, CN· patent location history
2021Patents assigned to DALIAN INST CHEM & PHYSICS CAS (1)· patent assignee history
2021Based in Dalian, CN· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
ENTHONE132007–2017
GEN ELECTRIC32016–2020
BIBO NETWORK LLC12020
CHEN QINGYUNself12013
DALIAN INST CHEM & PHYSICS CAS12021
Locations
LocationPatentsSpan
Branford, CT, US132007–2017
Bavaria, DE22017–2020
Dalian, CN12021
Shanghai, CN12020
Munich, DE12016