Inventor
Tatsuo Hirasawa
Inventor
Nirasaki, JP
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices24%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1019%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1014%
C23CCoating metallic material10%
H01JElectric discharge tubes or discharge lamps10%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form5%
C01GCompounds containing metals not covered by subclasses c01d or c01f5%
H05FStatic electricity5%
H10DInorganic electric semiconductor devices5%
H10NElectric solid-state devices not otherwise provided for5%
PatentTitleYear
10,309,005Deposition device and deposition method201910,189,230Method for forming copper film20199,406,557'Copper wiring forming method with Ru liner and Cu alloy fill'20169,406,558'Cu wiring fabrication method and storage medium'20169,253,862'Plasma processing method and plasma processing apparatus'2016Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2016–2019Patents assigned to TOKYO ELECTRON LTD (5)· patent assignee history
2016–2019Based in Nirasaki, JP· patent location history
2019Based in Yamanashi, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TOKYO ELECTRON LTD | 5 | 2016–2019 |
Locations
| Location | Patents | Span |
|---|---|---|
| Nirasaki, JP | 4 | 2016–2019 |
| Yamanashi, JP | 1 | 2019 |