Inventor
Jochen Schacht
Inventor
Hsinchu, TW
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1021%
Y10TTechnical subjects covered by former us classification14%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices7%
H01JElectric discharge tubes or discharge lamps7%
PatentTitleYear
7,494,915'Back end interconnect with a shaped interface'20097,348,279'Method of making an integrated circuit, including forming a contact'20087,241,681'Bilayered metal hardmasks for use in dual damascene etch schemes'20077,125,792'Dual damascene structure and method'20067,122,462'Back end interconnect with a shaped interface'20067,091,612'Dual damascene structure and method'20067,074,528'Effective assist pattern for nested and isolated contacts'20067,052,621'Bilayered metal hardmasks for use in Dual Damascene etch schemes'2006Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2006–2009Patents assigned to IBM (5)· patent assignee history
2006–2009Patents assigned to INFINEON TECHNOLOGIES AG (4)· patent assignee history
2006–2009Based in Hsinchu, TW· patent location history
2006Based in Dresden, DE· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 5 | 2006–2009 |
| INFINEON TECHNOLOGIES AG | 4 | 2006–2009 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu, TW | 7 | 2006–2009 |
| Dresden, DE | 1 | 2006 |