Inventor
Mikio Negishi
Inventor
Komoro, JP
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
H05KPrinted circuits21%
B23KSoldering or unsoldering14%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form11%
C22CAlloys11%
Y02PClimate change mitigation technologies in the production or processing of goods11%
H03FAmplifiers4%
Y10TTechnical subjects covered by former us classification4%
PatentTitleYear
8,022,551'Solder composition for electronic devices'20117,468,294'Semiconductor device and a method of manufacturing the same'20087,259,465'Semiconductor device with lead-free solder'20077,075,183'Electronic device'20067,023,706'Semiconductor device and manufacturing the same'20066,872,465'Solder'20056,831,360'Semiconductor device having an elastic resin with a low modulus of elasticity'2004Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2004–2006Patents assigned to RENESAS TECH CORP (2)· patent assignee history
2004–2011Based in Komoro, JP· patent location history
2005–2008Patents assigned to HITACHI LTD (4)· patent assignee history
2006Based in Tokyo, JP· patent location history
2011Patents assigned to RENESAS ELECTRONICS CORP (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HITACHI LTD | 4 | 2005–2008 |
| RENESAS TECH CORP | 2 | 2004–2006 |
| RENESAS ELECTRONICS CORP | 1 | 2011 |
Locations
| Location | Patents | Span |
|---|---|---|
| Komoro, JP | 6 | 2004–2011 |
| Tokyo, JP | 1 | 2006 |