Inventor
YOUBO LIN
Inventor
TW
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices25%
H10DInorganic electric semiconductor devices25%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1015%
B82YSpecific uses or applications of nanostructures10%
PatentTitleYear
11,996,353Air gap seal for interconnect air gap and method of fabricating thereof202411,855,155Semiconductor device having contact feature and method of fabricating the same202311,621,350Transistor structure and method with strain effect202311,328,982Air gap seal for interconnect air gap and method of fabricating thereof202211,302,784Semiconductor device having contact feature and method of fabricating the same2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2024Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (5)· patent assignee history
2022–2024Based in TW· patent location history
2022–2023Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 5 | 2022–2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 3 | 2022–2024 |
| US | 2 | 2022–2023 |