Inventor
ANDREAS ZLUC
Inventor
AT
Overview
Patents· 14 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits30%
H01LSemiconductor devices22%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1022%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation4%
H10HInorganic light-emitting semiconductor devices having potential barriers4%
B81BMicrostructural devices or systems, e.g. micromechanical devices2%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems2%
G02BOptical elements, systems or apparatus2%
H01RElectrically-conductive connections2%
H10DInorganic electric semiconductor devices2%
PatentTitleYear
12,501,551Method for embedding a component in a printed circuit board202512,424,504Component embedded in component carrier and having an exposed side wall202512,400,968Component with dielectric layer for embedding in component carrier202512,245,377Component carrier with embedded semiconductor component and embedded highly-conductive block which are mutually coupled202512,185,478Printed circuit board having embedded component202412,165,940Component carrier with surface-contactable component embedded in laminated stack202412,075,561Embedding component in component carrier by component fixation structure202411,749,613Component with dielectric layer for embedding in component carrier202311,749,573Component carrier with a stepped cavity and a stepped component assembly embedded within the stepped cavity202311,682,661Hermetic optical component package having organic portion and inorganic portion202311,658,142Connection arrangement, component carrier and method of forming a component carrier structure202311,570,897Component embedded in component carrier and having an exposed side wall202311,523,520Method for making contact with a component embedded in a printed circuit board202211,495,513Component carrier with embedded semiconductor component and embedded highly-conductive block which are mutually coupled2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to AT & S AUSTRIA TECH & SYSTEMTECHNIK AG (14)· patent assignee history
2022–2025Based in AT· patent location history
2023–2025Patents assigned to AT&SAUSTRIA TECH & SYSTEMTECHNIK AG (3)· patent assignee history
2023Patents assigned to AUSTRIA TECH & SYSTEM TECH (1)· patent assignee history
2025Patents assigned to AT&SAUSTRIA TECH & SYSTEMTECHNIK AKTIENGESELLSCHAFT (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| AT & S AUSTRIA TECH & SYSTEMTECHNIK AG | 14 | 2022–2025 |
| AT&SAUSTRIA TECH & SYSTEMTECHNIK AG | 3 | 2023–2025 |
| AT&SAUSTRIA TECH & SYSTEMTECHNIK AKTIENGESELLSCHAFT | 1 | 2025 |
| AUSTRIA TECH & SYSTEM TECH | 1 | 2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| AT | 14 | 2022–2025 |