Inventor
YEN-LIANG LIN
Inventor
TW
Overview
Patents· 52 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices28%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1016%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation9%
H10DInorganic electric semiconductor devices7%
G06FElectric digital data processing2%
H01JElectric discharge tubes or discharge lamps2%
C23CCoating metallic material1%
G06NComputing arrangements based on specific computational models1%
G06QInformation and communication technology [ict] specially adapted for administrative, commercial, financial, managerial or supervisory purposes1%
PatentTitleYear
12,581,711Semiconductor structure and method of manufacturing the same202612,564,089Package structure202612,555,759Semiconductor processing tool and methods of operation202612,550,633Diffusion barrier to mitigate direct-shortage leakage in conductive bridging ram (CBRAM)202612,457,816Wide channel semiconductor device202512,424,579Integrated chip including an upper conductive structure having multilayer stack to decrease fabrication costs and increase performance202512,417,946Film scheme to reduce plasma-induced damage202512,374,627Method of fabricating semiconductor structure202512,288,729Integrated circuit package and method202512,261,092Semiconductor package and manufacturing method thereof202512,255,184Semiconductor packages and methods of forming the same202512,248,872Machine learning framework for personalized clothing compatibility202512,218,173Image sensor device202512,218,051Method of manufacturing a semiconductor device including a plurality of circuit components and array of conductive contacts202512,211,737Cleaning chamber for metal oxide removal202512,191,327CMOS image sensor having indented photodiode structure202512,159,839Semiconductor packages202412,087,718Bump structure having a side recess and semiconductor structure including the same202412,087,563Semiconductor processing tool and methods of operation202412,087,597Semiconductor structure comprising various via structures202412,074,024Semiconductor devices and methods of manufacturing thereof202412,068,246Redistribution layer layouts on integrated circuits and methods for manufacturing the same202412,040,283Method of fabricating semiconductor structure202412,021,054Redistribution layer (RDL) layouts for integrated circuits202412,009,323Semiconductor structure202411,973,050Method for forming an upper conductive structure having multilayer stack to decrease fabrication costs and increase performance202411,942,433Integrated circuit package and method202411,935,804Integrated circuit package and method202411,855,118Image sensor device202311,843,007CMOS image sensor having indented photodiode structure202311,817,472Anchor structures and methods for uniform wafer planarization and bonding202311,791,299Redistribution layer (RDL) layouts for integrated circuits202311,784,198Wide channel semiconductor device202311,715,646Semiconductor structure and method for forming the same202311,682,655Semiconductor packages and methods of forming the same202311,664,325Semiconductor structure and method of fabricating the same202311,645,693Complementary consumer item selection202311,631,993Wireless charging devices having wireless charging coils and methods of manufacture thereof202311,631,648Bump structure having a side recess and semiconductor structure including the same202311,626,339Integrated circuit package and method202311,544,900Primitive-based 3D building modeling, sensor simulation, and estimation202311,532,662Method of forming image sensor device202211,502,039Semiconductor package and method202211,481,998Building footprint generation by using clean mask generation and received image data202211,476,843Signal receiving device and bias voltage calibration circuit thereof202211,456,263Semiconductor structure and method for forming the same202211,380,721Wide channel gate structure202211,244,906Semiconductor structure and method of fabricating the same202211,227,837Integrated circuit package and method202211,189,743Single photon avalanche diode202111,183,523CMOS image sensor having indented photodiode structure202111,152,417Anchor structures and methods for uniform wafer planarization and bonding2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (47)· patent assignee history
2021–2026Based in TW· patent location history
2022–2023Patents assigned to GEN ELECTRIC (2)· patent assignee history
2022Patents assigned to ALI CORP (1)· patent assignee history
2022–2025Based in US· patent location history
2023–2025Patents assigned to AMAZON TECH INC (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 47 | 2021–2026 |
| AMAZON TECH INC | 2 | 2023–2025 |
| GEN ELECTRIC | 2 | 2022–2023 |
| ALI CORP | 1 | 2022 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 48 | 2021–2026 |
| US | 4 | 2022–2025 |