Inventor

CHIEN-WEN LAI

Inventor
TW

Overview

24→
Patents
2021–2025
Patent span
Electricity
Primary field (CPC H)

Patents· 24 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices30%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1030%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%
C23CCoating metallic material3%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices3%
H10BElectronic memory devices3%
H10DInorganic electric semiconductor devices3%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests3%
B60QArrangement of signalling or lighting devices, the mounting or supporting thereof or circuits therefor, for vehicles in general1%
G01SRadio direction-finding1%
PatentTitleYear
12,494,359Stacked wafer structure and method for forming the same202512,494,411Integrated circuit and method of forming the same202512,266,528Method for forming patterned mask layer202512,243,744Method for forming semiconductor structure202512,191,155Semiconductor structures and method for manufacturing the same202512,125,712Landing metal etch process for improved overlay control202412,080,544Stacked wafer structure and method for forming the same202412,062,543Line-end extension method and device202412,014,926Self aligned litho etch process patterning method202411,955,338Directional deposition for semiconductor fabrication202411,862,465Fine line patterning methods202411,854,807Line-end extension method and device202311,798,812Landing metal etch process for improved overlay control202311,748,549Method and apparatus for integrated circuit mask patterning202311,715,638Method for forming semiconductor structure202311,699,589Method for forming patterned mask layer202311,610,778Self aligned litho etch process patterning method202311,569,090Directional deposition for semiconductor fabrication202311,322,362Landing metal etch process for improved overlay control202211,294,286Pattern formation method using a photo mask for manufacturing a semiconductor device202211,289,332Directional processing to remove a layer or a material formed over a substrate202211,275,175Method for detecting objects via a vehicular sensing system202211,239,078Fine line patterning methods202211,201,064Signal line patterning for standard cells2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (23)· patent assignee history
2021–2025Based in TW· patent location history
2022Patents assigned to MAGNA ELECTRONICS INC (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAIWAN SEMICONDUCTOR MFG CO LTD232021–2025
MAGNA ELECTRONICS INC12022
Locations
LocationPatentsSpan
TW242021–2025