Inventor
Takahisa Shiraishi
Inventor
Saga, JP
Overview
Patents· 2 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C23Cprimary
C23CCoating metallic material13%
H01LSemiconductor devices13%
H01RElectrically-conductive connections13%
H05KPrinted circuits13%
H10NElectric solid-state devices not otherwise provided for13%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
Y02PClimate change mitigation technologies in the production or processing of goods13%
Y10TTechnical subjects covered by former us classification13%
Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2014Patents assigned to FUJIFILM CORP (1)· patent assignee history
2014Patents assigned to TOKYO INST TECH (1)· patent assignee history
2014Based in Tokyo, JP· patent location history
2021Patents assigned to OMRON TATEISI ELECTRONICS CO (1)· patent assignee history
2021Based in Saga, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| FUJIFILM CORP | 1 | 2014 |
| OMRON TATEISI ELECTRONICS CO | 1 | 2021 |
| TOKYO INST TECH | 1 | 2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Saga, JP | 1 | 2021 |
| Tokyo, JP | 1 | 2014 |