Inventor
YUYA ISHIMA
Inventor
JP
Overview
Patents· 19 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Fprimary
H01FMagnets66%
C22CAlloys7%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices7%
B22FWorking metallic powder3%
G03GElectrography3%
H01BCables3%
H01GCapacitors3%
H05KPrinted circuits3%
Y10TTechnical subjects covered by former us classification3%
PatentTitleYear
12,573,539Coil-type electronic component202612,525,381Multilayer coil component202612,469,639Method for manufacturing multilayer coil component202512,456,567Multilayer coil component202512,440,892Soft magnetic alloy powder, soft magnetic sintered body, and coil-type electronic component202512,444,529Multilayer coil component202512,362,078Photosensitive conductive paste, laminated electronic component, and method of manufacturing laminated electronic component202512,354,785Multilayer coil component202512,249,453Multilayer coil component202511,955,275Method for producing multilayer coil component202411,915,852Electronic component202411,749,445Laminated coil component202311,705,276Method for manufacturing electronic-component202311,488,761Laminated electronic component202211,302,466Multilayer coil electronic component202211,217,376Laminated electronic component202211,211,192Laminated coil component202111,211,188Multilayer coil component202111,139,112Electronic component2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to TDK CORP (19)· patent assignee history
2021–2026Based in JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TDK CORP | 19 | 2021–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 19 | 2021–2026 |