Inventor
Kyle M. Hanson
Inventor
Kalispell, MT, US
Overview
Patents· 101 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C25Dprimary
C25DProcesses for the electrolytic or electrophoretic production of coatings29%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1027%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests7%
H01LSemiconductor devices6%
C25FProcesses for the electrolytic removal of materials from objects5%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices5%
C23CCoating metallic material2%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution2%
B60LPropulsion of electrically-propelled vehicles1%
B65GTransport or storage devices, e.g. conveyors for loading or tipping, shop conveyor systems or pneumatic tube conveyors1%
PatentTitleYear
10,845,715Post exposure processing apparatus202010,840,104Controlled etch of nitride features202010,754,252Apparatus for post exposure bake202010,401,742Post exposure processing apparatus201910,240,248Adaptive electric field shielding in an electroplating processor using agitator geometry and motion control201910,191,379Removing photoresist from a wafer20199,984,867Systems and methods for rinsing and drying substrates20189,964,863Post exposure processing apparatus20189,958,782Apparatus for post exposure bake20189,937,802Systems and methods for determining a duty cycle for a variable voltage converter20189,864,283'Apparatus and methods for photomask backside cleaning'20189,859,135'Substrate rinsing systems and methods'20189,799,537'Processing assembly for semiconductor workpiece and methods of processing same'20179,692,279'Wound field rotating machine with capacitive power transfer'20179,673,742'Controlling magnetic flux in an automotive electric machine'20179,245,767'Anneal module for semiconductor wafers'20169,234,293'Electrolytic copper process using anion permeable barrier'20169,160,025'Flow battery systems'20158,961,771'Electrolytic process using cation permeable barrier'20158,852,417'Electrolytic process using anion permeable barrier'20148,808,888'Flow battery systems'20148,736,137'Wound field rotating machine with capacitive power transfer'20148,541,309'Processing assembly for semiconductor workpiece and methods of processing same'20138,500,968'Deplating contacts in an electrochemical plating apparatus'20138,496,789'Electrochemical processor'20138,236,159'Electrolytic process using cation permeable barrier'20128,123,926'Electrolytic copper process using anion permeable barrier'20128,104,488'Single side workpiece processing'20127,938,942'Single side workpiece processing'20117,935,230'Electro-chemical processor'20117,927,469'Electro-chemical processor'20117,909,967'Electro-chemical processor'20117,857,958'Method and apparatus for controlling vessel characteristics, including shape and thieving current for processing microfeature workpieces'20107,645,366'Microelectronic workpiece holders and contact assemblies for use therewith'20107,628,898'Method and system for idle state operation'20097,585,398'Chambers, systems, and methods for electrochemically processing microfeature workpieces'20097,566,386'System for electrochemically processing a workpiece'20097,438,788'Apparatus and methods for electrochemical processing of microelectronic workpieces'20087,357,850'Electroplating apparatus with segmented anode array'20087,351,315'Chambers, systems, and methods for electrochemically processing microfeature workpieces'20087,351,314'Chambers, systems, and methods for electrochemically processing microfeature workpieces'20087,294,244'Microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece'20077,267,749'Workpiece processor having processing chamber with improved processing fluid flow'20077,264,698'Apparatus and methods for electrochemical processing of microelectronic workpieces'20077,252,714'Apparatus and method for thermally controlled processing of microelectronic workpieces'20077,247,223'Method and apparatus for controlling vessel characteristics, including shape and thieving current for processing microfeature workpieces'20077,217,325'System for processing a workpiece'20077,169,280'Apparatus and method for deposition of an electrophoretic emulsion'20077,150,816'Apparatus and method for deposition of an electrophoretic emulsion'20067,147,760'Electroplating apparatus with segmented anode array'20067,147,765'Apparatus and method for deposition of an electrophoretic emulsion'20067,118,658'Electroplating reactor'20067,114,903'Apparatuses and method for transferring and/or pre-processing microelectronic workpieces'20067,090,751'Apparatus and methods for electrochemical processing of microelectronic workpieces'20067,002,698'Semiconductor processing apparatus having lift and tilt mechanism'20066,969,682'Single workpiece processing system'20056,930,046'Single workpiece processing system'20056,921,468'Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations'20056,921,467'Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces'20056,916,412'Adaptable electrochemical processing chamber'20056,890,415'Reactor vessel having improved cup, anode and conductor assembly'20056,881,309'Diffuser with spiral opening pattern for electroplating reactor vessel'20056,878,955'Method and apparatus for accessing microelectronic workpiece containers'20056,869,510'Methods and apparatus for processing the surface of a microelectronic workpiece'20056,854,473'Method and apparatus for executing plural processes on a microelectronic workpiece at a single processing station'20056,849,167'Electroplating reactor including back-side electrical contact apparatus'20056,761,806'Processing apparatus with sensory subsystem for detecting the presence/absence of wafers or other workpieces'20046,717,171'Method and apparatus for accessing microelectronic workpiece containers'20046,699,373'Apparatus for processing the surface of a microelectronic workpiece'20046,672,820'Semiconductor processing apparatus having linear conveyer system'20046,663,762'Plating system workpiece support having workpiece engaging electrode'20036,660,137'System for electrochemically processing a workpiece'20036,654,122'Semiconductor processing apparatus having lift and tilt mechanism'20036,645,356'Methods and apparatus for processing the surface of a microelectronic workpiece'20036,645,355'Semiconductor processing apparatus having lift and tilt mechanism'20036,569,297'Workpiece processor having processing chamber with improved processing fluid flow'20036,547,937'Microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece'20036,527,926'Electroplating reactor including back-side electrical contact apparatus'20036,497,801'Electroplating apparatus with segmented anode array'20026,471,460'Apparatus for processing a microelectronic workpiece including a workpiece cassette inventory assembly'20026,428,662'Reactor vessel having improved cup, anode and conductor assembly'20026,428,660'Reactor vessel having improved cup, anode and conductor assembly'20026,409,892'Reactor vessel having improved cup, anode, and conductor assembly'20026,368,475'Apparatus for electrochemically processing a microelectronic workpiece'20026,358,388'Plating system workpiece support having workpiece-engaging electrodes with distal contact-part and dielectric cover'20026,322,678'Electroplating reactor including back-side electrical contact apparatus'20016,309,524'Methods and apparatus for processing the surface of a microelectronic workpiece'20016,309,520'Methods and apparatus for processing the surface of a microelectronic workpiece'20016,303,010'Methods and apparatus for processing the surface of a microelectronic workpiece'20016,280,583'Reactor assembly and method of assembly'20016,280,582'Reactor vessel having improved cup, anode and conductor assembly'20016,270,647'Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations'20016,254,742'Diffuser with spiral opening pattern for an electroplating reactor vessel'20016,251,692'Semiconductor processing workpiece support with sensory subsystem for detection of wafers or other semiconductor workpieces'20016,228,232'Reactor vessel having improved cup anode and conductor assembly'20016,139,703'Cathode current control system for a wafer electroplating apparatus'20006,091,498'Semiconductor processing apparatus having lift and tilt mechanism'20006,080,291'Apparatus for electrochemically processing a workpiece including an electrical contact assembly having a seal member'20006,004,828'Semiconductor processing workpiece support with sensory subsystem for detection of wafers or other semiconductor workpieces'19996,004,440'Cathode current control system for a wafer electroplating apparatus'19995,985,126'Semiconductor plating system workpiece support having workpiece engaging electrodes with distal contact part and dielectric cover'1999Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1999–2011Patents assigned to SEMITOOL INC (72)· patent assignee history
1999–2020Based in Kalispell, MT, US· patent location history
2011–2020Patents assigned to APPLIED MATERIALS INC (25)· patent assignee history
2012–2017Patents assigned to HANSON KYLE M (10)· patent assignee history
2012–2015Patents assigned to BASKARAN RAJESH (4)· patent assignee history
2012–2015Patents assigned to BATZ JR ROBERT W (4)· patent assignee history
2014–2017Based in Livonia, MI, US· patent location history
2017–2018Based in Madison, WI, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SEMITOOL INC | 72 | 1999–2011 |
| APPLIED MATERIALS INC | 25 | 2011–2020 |
| HANSON KYLE Mself | 10 | 2012–2017 |
| BASKARAN RAJESH | 4 | 2012–2015 |
| BATZ JR ROBERT W | 4 | 2012–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kalispell, MT, US | 97 | 1999–2020 |
| Madison, WI, US | 2 | 2017–2018 |
| Livonia, MI, US | 2 | 2014–2017 |