LexDanaLexDanabeta
Inventor

Yan-Yi Wu

Inventor
Shanghai, CN

Overview

5→
Patents
2008–2012
Patent span
Electricity
Primary field (CPC H)

Patents· 5 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1071%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1029%
PatentTitleYear
8,105,881'Method of fabricating chip package structure'20128,088,650'Method of fabricating chip package'20127,741,149'Method of fabricating chip package structure'20107,683,462'Chip package structure'20107,361,984'Chip package structure'2008

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2008–2012Patents assigned to CHIPMOS TECHNOLOGIES BERMUDA (5)· patent assignee history
2008Patents assigned to CHIPMOS TECHNOLOGIES SHANGHAI (1)· patent assignee history
2008–2012Based in Shanghai, CN· patent location history
2012Patents assigned to CHIOU JIE-HUNG (2)· patent assignee history
2012Patents assigned to QIAO YONG-CHAO (2)· patent assignee history
2012Patents assigned to WU YAN-YI (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
CHIPMOS TECHNOLOGIES BERMUDA52008–2012
CHIOU JIE-HUNG22012
QIAO YONG-CHAO22012
WU YAN-YIself22012
CHIPMOS TECHNOLOGIES SHANGHAI12008
Locations
LocationPatentsSpan
Shanghai, CN52008–2012