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Inventor

Rolf Lehner

Inventor
Esslingen, DE

Overview

4→
Patents
1987–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1033%
B24BMachines, devices, or processes for grinding or polishing11%
B65HHandling thin or filamentary material, e.g. sheets, webs, cables11%
H01LSemiconductor devices11%
H10DInorganic electric semiconductor devices11%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests11%
Y10TTechnical subjects covered by former us classification11%
PatentTitleYear
10,974,365Method for processing semiconductor wafers using a grinding wheel20215,452,905'Spinning plate for substrates'19955,377,476'Arrangement for storing, transporting and loading substrates'19954,641,070'Device for determining and adjusting the position of a web'1987

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1987Patents assigned to HEIDELBERGER DRUCKMASCH AG (1)· patent assignee history
1987Based in Kirchheim, DE· patent location history
1995Patents assigned to IBM (2)· patent assignee history
1995Based in Esslingen, DE· patent location history
2021Patents assigned to INFINEON TECHNOLOGIES AG (1)· patent assignee history
2021Based in Laaber, DE· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
IBM21995
HEIDELBERGER DRUCKMASCH AG11987
INFINEON TECHNOLOGIES AG12021
Locations
LocationPatentsSpan
Esslingen, DE21995
Laaber, DE12021
Kirchheim, DE11987