LexDanaLexDanabeta
Inventor

James S. Papanu

Inventor
San Rafael, CA, US

Overview

56→
Patents
1996–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 56 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1027%
H01LSemiconductor devices20%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1012%
B23KSoldering or unsoldering9%
H01JElectric discharge tubes or discharge lamps8%
H10DInorganic electric semiconductor devices5%
C23CCoating metallic material4%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%
B08BCleaning in general2%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices2%
PatentTitleYear
11,011,424Hybrid wafer dicing approach using a spatially multi-focused laser beam laser scribing process and plasma etch process202110,903,121Hybrid wafer dicing approach using a uniform rotating beam laser scribing process and plasma etch process202110,535,561Hybrid wafer dicing approach using a multiple pass laser scribing process and plasma etch process20209,972,575Hybrid wafer dicing approach using a split beam laser scribing process and plasma etch process20189,852,997Hybrid wafer dicing approach using a rotating beam laser scribing process and plasma etch process20179,793,132'Etch mask for hybrid laser scribing and plasma etch wafer singulation process'20179,768,014'Wafer coating'20179,601,375'UV-cure pre-treatment of carrier film for wafer dicing using hybrid laser scribing and plasma etch approach'20179,583,375'Water soluble mask formation by dry film lamination'20179,443,765'Water soluble mask formation by dry film vacuum lamination for laser and plasma dicing'20169,412,619'Method of outgassing a mask material deposited over a workpiece in a process tool'20169,355,907'Hybrid wafer dicing approach using a line shaped laser beam profile laser scribing process and plasma etch process'20169,343,366'Dicing wafers having solder bumps on wafer backside'20169,312,177'Screen print mask for laser scribe and plasma etch wafer dicing process'20169,299,611'Method of wafer dicing using hybrid laser scribing and plasma etch approach with mask plasma treatment for improved mask etch resistance'20169,281,244'Hybrid wafer dicing approach using an adaptive optics-controlled laser scribing process and plasma etch process'20169,275,902'Dicing processes for thin wafers with bumps on wafer backside'20169,245,803'Hybrid wafer dicing approach using a bessel beam shaper laser scribing process and plasma etch process'20169,209,084'Maskless hybrid laser scribing and plasma etching wafer dicing process'20159,196,536'Hybrid wafer dicing approach using a phase modulated laser beam profile laser scribing process and plasma etch process'20159,177,861'Hybrid wafer dicing approach using laser scribing process based on an elliptical laser beam profile or a spatio-temporal controlled laser beam profile'20159,165,832'Method of die singulation using laser ablation and induction of internal defects with a laser'20159,159,624'Vacuum lamination of polymeric dry films for wafer dicing using hybrid laser scribing and plasma etch approach'20159,130,057'Hybrid dicing process using a blade and laser'20159,130,030'Baking tool for improved wafer coating process'20159,130,056'Bi-layer wafer-level underfill mask for wafer dicing and approaches for performing wafer dicing'20159,093,518'Singulation of wafers having wafer-level underfill'20159,076,860'Residue removal from singulated die sidewall'20159,041,198'Maskless hybrid laser scribing and plasma etching wafer dicing process'20159,012,305'Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate non-reactive post mask-opening clean'20158,991,329'Wafer coating'20158,975,163'Laser-dominated laser scribing and plasma etch hybrid wafer dicing'20158,932,939'Water soluble mask formation by dry film lamination'20158,927,393'Water soluble mask formation by dry film vacuum lamination for laser and plasma dicing'20158,912,078'Dicing wafers having solder bumps on wafer backside'20148,883,615'Approaches for cleaning a wafer during hybrid laser scribing and plasma etching wafer dicing processes'20148,361,835'Method for forming transparent conductive oxide'20138,318,589'Method for forming transparent conductive oxide'20128,002,899'Method and apparatus for mask pellicle adhesive residue cleaning'20117,914,623'Post-ion implant cleaning for silicon on insulator substrate preparation'20117,846,347'Method for removing a halogen-containing residue'20107,718,009'Cleaning submicron structures on a semiconductor wafer surface'20107,694,688'Wet clean system design'20107,648,916'Method and apparatus for performing hydrogen optical emission endpoint detection for photoresist strip and residue removal'20107,604,708'Cleaning of native oxide with hydrogen-containing radicals'20097,432,177'Post-ion implant cleaning for silicon on insulator substrate preparation'20087,374,696'Method and apparatus for removing a halogen-containing residue'20086,991,739'Method of photoresist removal in the presence of a dielectric layer having a low k-value'20066,692,903'Substrate cleaning apparatus and method'20046,120,608'Workpiece support platen for semiconductor process chamber'20005,885,358'Gas injection slit nozzle for a plasma process reactor'19995,817,534'RF plasma reactor with cleaning electrode for cleaning during processing of semiconductor wafers'19985,756,400'Method and apparatus for cleaning by-products from plasma chamber surfaces'19985,746,875'Gas injection slit nozzle for a plasma process reactor'19985,643,394'Gas injection slit nozzle for a plasma process reactor'19975,545,289'Passivating, stripping and corrosion inhibition of semiconductor substrates'1996

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1996–2021Patents assigned to APPLIED MATERIALS INC (56)· patent assignee history
1996–2021Based in San Rafael, CA, US· patent location history
2012–2017Patents assigned to PAPANU JAMES S (23)· patent assignee history
2014–2017Patents assigned to KUMAR AJAY (22)· patent assignee history
2014–2017Patents assigned to LEI WEI-SHENG (22)· patent assignee history
2014–2017Patents assigned to EATON BRAD (21)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
APPLIED MATERIALS INC561996–2021
PAPANU JAMES Sself232012–2017
KUMAR AJAY222014–2017
LEI WEI-SHENG222014–2017
EATON BRAD212014–2017
Locations
LocationPatentsSpan
San Rafael, California, US561996–2021