Inventor
Martin Zgaga
Inventor
Rosegg, AT
Overview
Patents· 16 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1025%
H01LSemiconductor devices20%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1014%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems13%
B81BMicrostructural devices or systems, e.g. micromechanical devices11%
H10DInorganic electric semiconductor devices9%
B01DSeparation4%
Y10TTechnical subjects covered by former us classification4%
H04RLoudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers2%
PatentTitleYear
10,672,716Integrated circuit substrate and method for manufacturing the same202010,157,765Methods for processing a semiconductor workpiece201810,020,264Integrated circuit substrate and method for manufacturing the same201810,005,659Method for simultaneous structuring and chip singulation20189,741,618'Methods of forming semiconductor devices'20179,708,182'Methods for producing a cavity within a semiconductor substrate'20179,673,096'Method for processing a semiconductor substrate and a method for processing a semiconductor wafer'20179,610,543'Method for simultaneous structuring and chip singulation'20179,496,193'Semiconductor chip with structured sidewalls'20169,481,563'Semiconductor device having a micro-mechanical structure'20169,257,342'Methods of singulating substrates to form semiconductor devices using dummy material'20169,139,427'Methods for producing a cavity within a semiconductor substrate'20159,006,109'Semiconductor devices and methods for manufacturing semiconductor devices'20158,871,550'Method for processing a wafer at unmasked areas and previously masked areas to reduce a wafer thickness'20148,772,133'Utilization of a metallization scheme as an etching mask'20148,748,297'Methods of forming semiconductor devices by singulating a substrate by removing a dummy fill material'2014Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2014–2020Patents assigned to INFINEON TECHNOLOGIES AG (16)· patent assignee history
2014Patents assigned to ZGAGA MARTIN (3)· patent assignee history
2014Patents assigned to STRANZL GUDRUN (2)· patent assignee history
2014Patents assigned to DENIFL GUENTER (1)· patent assignee history
2014Patents assigned to ENGELHARDT MANFRED (1)· patent assignee history
2014–2020Based in Rosegg, AT· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INFINEON TECHNOLOGIES AG | 16 | 2014–2020 |
| ZGAGA MARTINself | 3 | 2014 |
| STRANZL GUDRUN | 2 | 2014 |
| DENIFL GUENTER | 1 | 2014 |
| ENGELHARDT MANFRED | 1 | 2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Rosegg, AT | 16 | 2014–2020 |