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Inventor

DAIGO ICHIKAWA

Inventor
JP

Overview

3→
Patents
2023–2026
Patent span
Physics
Primary field (CPC G)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B23Kprimary
B23KSoldering or unsoldering25%
H05KPrinted circuits25%
G01CMeasuring distances, levels or bearings13%
G06VImage or video recognition or understanding13%
G08GTraffic control systems13%
Y02PClimate change mitigation technologies in the production or processing of goods13%
PatentTitleYear
12,566,072Information processing device and information processing method202612,454,030Solder composition and method for manufacturing flexible circuit board202511,780,035Solder composition and electronic substrate2023

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2023–2025Patents assigned to TAMURA SEISAKUSHO KK (2)· patent assignee history
2023–2026Based in JP· patent location history
2026Patents assigned to TOYOTA MOTOR CO LTD (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAMURA SEISAKUSHO KK22023–2025
TOYOTA MOTOR CO LTD12026
Locations
LocationPatentsSpan
JP32023–2026