Inventor
PAUL MERLE EMERSON
Inventor
US
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices39%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1039%
H10DInorganic electric semiconductor devices11%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
PatentTitleYear
12,237,247Semiconductor package with top circuit and an IC with a gap over the IC202512,176,255Cantilevered dies in ceramic packages202411,837,529Semiconductor package with top circuit and an IC with a gap over the IC202311,664,273Adjusting reactive components202311,538,767Integrated circuit package with partitioning based on environmental sensitivity202211,302,611Semiconductor package with top circuit and an IC with a gap over the IC202211,270,939Additively manufactured programmable resistive jumpers2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to TEXAS INSTRUMENTS INC (7)· patent assignee history
2022–2025Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TEXAS INSTRUMENTS INC | 7 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 7 | 2022–2025 |