Inventor
Robert David Sebesta
Inventor
Endicott, NY, US
Overview
Patents· 21 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits39%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%
Y10TTechnical subjects covered by former us classification18%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices6%
C25DProcesses for the electrolytic or electrophoretic production of coatings4%
C23FNon-mechanical removal of metallic material from surface2%
H01RElectrically-conductive connections2%
PatentTitleYear
7,098,136'Structure having flush circuit features and method of making'20067,024,764'Method of making an electronic package'20066,989,297'Variable thickness pads on a substrate surface'20066,900,545'Variable thickness pads on a substrate surface'20056,829,823'Method of making a multi-layered interconnect structure'20046,815,709'Structure having flush circuitry features and method of making'20046,618,940'Fine pitch circuitization with filled plated through holes'20036,580,491'Apparatus and method for compensating for distortion of a printed circuit workpiece substrate'20036,580,494'Method and system of distortion compensation in a projection imaging expose system'20036,538,213'High density design for organic chip carriers'20036,429,113'Method for connecting an electrical device to a circuit substrate'20026,373,717'Electronic package with high density interconnect layer'20026,351,393'Electronic package for electronic components and method of making same'20026,291,779'Fine pitch circuitization with filled plated through holes'20016,077,766'Variable thickness pads on a substrate surface'20006,014,809'Method for circuitizing over an edge of a circuit card'20006,013,417'Process for fabricating circuitry on substrates having plated through-holes'20005,858,254'Multilayered circuitized substrate and method of fabrication'19995,712,192'Process for connecting an electrical device to a circuit substrate'19985,612,573'Electronic package with multilevel connections'19975,505,320'Method employing laser ablating for providing a pattern on a substrate'1996Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1996–2006Patents assigned to IBM (21)· patent assignee history
1996–2006Based in Endicott, NY, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 21 | 1996–2006 |
Locations
| Location | Patents | Span |
|---|---|---|
| Endicott, New York, US | 21 | 1996–2006 |