Inventor
Vincent DiCaprio
Inventor
Mesa, AZ, US
Overview
Patents· 33 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1073%
H01LSemiconductor devices7%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
Y10TTechnical subjects covered by former us classification4%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices2%
H01QAntennas, i.e. radio aerials2%
H05KPrinted circuits2%
H10DInorganic electric semiconductor devices2%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests2%
PatentTitleYear
10,937,726Package structure with embedded core202110,886,232Package structure and fabrication methods202110,727,083Method for via formation in flowable epoxy materials by micro-imprint20208,258,613'Semiconductor memory card'2012RE040112'Semiconductor package and method for fabricating the same'20087,211,900'Thin semiconductor package including stacked dies'20077,190,071'Semiconductor package and method for fabricating the same'20077,126,218'Embedded heat spreader ball grid array'20067,061,120'Stackable semiconductor package having semiconductor chip within central through hole of substrate'20066,982,488'Semiconductor package and method for fabricating the same'20066,830,955'Semiconductor package and method for manufacturing the same'20046,798,049'Semiconductor package and method for fabricating the same'20046,762,078'Semiconductor package having semiconductor chip within central aperture of substrate'20046,717,248'Semiconductor package and method for fabricating the same'20046,683,377'Multi-stacked memory package'20046,656,765'Fabricating very thin chip size semiconductor packages'20036,650,019'Method of making a semiconductor package including stacked semiconductor dies'20036,624,005'Semiconductor memory cards and method of making same'20036,589,801'Wafer-scale production of chip-scale semiconductor packages using wafer mapping techniques'20036,577,013'Chip size semiconductor packages with stacked dies'20036,531,784'Semiconductor package with spacer strips'20036,517,656'Method of making an integrated circuit package using a batch step for curing a die attachment film and a tool system for performing the method'20036,515,356'Semiconductor package and method for fabricating the same'20036,512,288'Circuit board semiconductor package'20036,501,184'Semiconductor package and method for manufacturing the same'20026,489,667'Semiconductor device and method of manufacturing such device'20026,472,758'Semiconductor package including stacked semiconductor dies and bond wires'20026,462,274'Chip-scale semiconductor package of the fan-out type and method of manufacturing such packages'20026,452,278'Low profile package for plural semiconductor dies'20026,414,396'Package for stacked integrated circuits'20026,406,934'Wafer level production of chip size semiconductor packages'20026,395,578'Semiconductor package and method for fabricating the same'20026,340,846'Making semiconductor packages with stacked dies and reinforced wire bonds'2002Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2002–2012Patents assigned to AMKOR TECHNOLOGY INC (30)· patent assignee history
2002Patents assigned to ANAM SEMICONDUCTOR INC (1)· patent assignee history
2002–2012Based in Mesa, AZ, US· patent location history
2006–2008Based in Chandler, AZ, US· patent location history
2012Patents assigned to DICAPRIO VINCENT (1)· patent assignee history
2012Patents assigned to KASKOUN KENNETH (1)· patent assignee history
2020–2021Patents assigned to APPLIED MATERIALS INC (3)· patent assignee history
2020–2021Based in Pleasanton, CA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| AMKOR TECHNOLOGY INC | 30 | 2002–2012 |
| APPLIED MATERIALS INC | 3 | 2020–2021 |
| ANAM SEMICONDUCTOR INC | 1 | 2002 |
| DICAPRIO VINCENTself | 1 | 2012 |
| KASKOUN KENNETH | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Mesa, AZ, US | 28 | 2002–2012 |
| Pleasanton, California, US | 3 | 2020–2021 |
| Chandler, AZ, US | 2 | 2006–2008 |