Inventor
JUMPEI FUJIKATA
Inventor
JP
Overview
Patents· 13 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C25Dprimary
C25DProcesses for the electrolytic or electrophoretic production of coatings29%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
B01FMixing, e.g. dissolving, emulsifying or dispersing10%
H01LSemiconductor devices10%
Y02PClimate change mitigation technologies in the production or processing of goods7%
C23CCoating metallic material5%
G01MTesting static or dynamic balance of machines or structures5%
G05BControl or regulating systems in general5%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h105%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering2%
PatentTitleYear
12,191,178Semiconductor manufacturing apparatus, failure prediction method for semiconductor manufacturing apparatus, and failure prediction program for semiconductor manufacturing apparatus202512,116,687Powder supply apparatus and plating system202411,891,715Paddle, processing apparatus having the paddle, and method of producing the paddle202411,717,796Paddle, plating apparatus equipped with the paddle, and plating method202311,686,647Leak check method, leak check apparatus, plating method, and plating apparatus202311,604,150Device for measuring bump height, apparatus for processing substrate, method of measuring bump height, and storage medium202311,535,949Substrate holder and plating apparatus202211,447,885Plating method and plating apparatus202211,385,125Leak check method, leak check apparatus, plating method, and plating apparatus202211,371,155Method and apparatus for processing a substrate202211,359,304Powder supply apparatus and plating system202211,315,812Semiconductor manufacturing apparatus, failure prediction method for semiconductor manufacturing apparatus, and failure prediction program for semiconductor manufacturing apparatus202211,230,789Method of removing liquid from seal of a substrate holder2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to EBARA CORP (13)· patent assignee history
2022–2025Based in JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| EBARA CORP | 13 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 13 | 2022–2025 |