Inventor

Walter L. Moden

Inventor

Meridian, ID, US

Overview

1992–2018

Patent span

Electricity

Primary field (CPC H)

Patents· 195 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1042%

H05KPrinted circuits19%

Y10TTechnical subjects covered by former us classification13%

Y02PClimate change mitigation technologies in the production or processing of goods8%

H01RElectrically-conductive connections4%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h103%

G01RMeasuring electric variables2%

B25BTools or bench devices not otherwise provided for, for fastening, connecting, disengaging, or holding1%

B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering1%

PatentTitleYear

10,083,937Semiconductor devices and packages and methods of forming semiconductor device packages2018 9,502,369'Semiconductor devices and packages'2016 8,299,598'Grid array packages and assemblies including the same'2012 8,198,138'Methods for providing and using grid array packages'2012 8,164,175'Stackable semiconductor device assemblies'2012 RE043112'Stackable ball grid array package'2012 8,049,317'Grid array packages'2011 8,035,974'Integrated circuit package support system'2011 7,894,192'Integrated circuit package support system'2011 7,871,859'Vertical surface mount assembly and methods'2011 7,829,991'Stackable ceramic FBGA for high thermal applications'2010 7,663,224'Semiconductor BGA package having a segmented voltage plane'2010 7,600,314'Methods for installing a plurality of circuit devices'2009 7,569,418'Methods for securing packaged semiconductor devices to carrier substrates'2009 7,501,313'Method of making semiconductor BGA package having a segmented voltage plane'2009 7,408,255'Assembly for stacked BGA packages'2008 7,400,032'Module assembly for stacked BGA packages'2008 7,396,702'Module assembly and method for stacked BGA packages'2008 7,381,591'Flip-chip adaptor package for bare die'2008 7,329,945'Flip-chip adaptor package for bare die'2008 7,285,442'Stackable ceramic FBGA for high thermal applications'2007 7,279,797'Module assembly and method for stacked BGA packages'2007 7,233,064'Semiconductor BGA package having a segmented voltage plane and method of making'2007 7,227,261'Vertical surface mount assembly and methods'2007 7,215,015'Imaging system'2007 7,200,022'Apparatus and method for mounting microelectronic devices on a mirrored board assembly'2007 7,161,821'Apparatus and method for mounting microelectronic devices on a mirrored board assembly'2007 7,105,380'Method of temporarily securing a die to a burn-in carrier'2006 7,087,116'Apparatus for modifying the configuration of an exposed surface of a viscous fluid'2006 7,082,681'Methods for modifying a vertical surface mount package'2006 7,065,868'Methods for installing a circuit device'2006 6,979,598'Method of attaching a leadframe to singulated semiconductor dice'2005 6,974,725'Interconnections for a semiconductor device'2005 6,970,359'Reduced-sized memory card package, length-extending adaptor and method of forming adaptor'2005 6,969,632'Method for fabricating image sensor semiconductor package'2005 6,963,128'Vertically mountable and alignable semiconductor device assembly'2005 6,917,090'Chip scale image sensor package'2005 6,903,465'Method and apparatus for a semiconductor package for vertical surface mounting'2005 6,894,521'Burn-in carrier for a semiconductor die'2005 6,890,384'Apparatus and method for modifying the configuration of an exposed surface of a viscous fluid'2005 6,876,562'Apparatus and method for mounting microelectronic devices on a mirrored board assembly'2005 6,865,086'Apparatus and method to secure an adaptor to a reduced-sized memory card'2005 6,861,290'Flip-chip adaptor package for bare die'2005 6,858,926'Stackable ceramic FBGA for high thermal applications'2005 6,858,467'Method for fabricating semiconductor packages with stacked dice and leadframes'2005 6,838,768'Module assembly for stacked BGA packages'2005 6,828,173'Semiconductor device including edge bond pads and methods'2004 6,825,547'Semiconductor device including edge bond pads'2004 6,818,460'Method for applying adhesives to a lead frame'2004 6,803,656'Semiconductor device including combed bond pad opening'2004 6,800,505'Semiconductor device including edge bond pads and related methods'2004 6,788,547'Method of making electrical contact device'2004 6,781,839'Vertical surface mount apparatus with thermal carrier and method'2004 6,777,261'Method and apparatus for a semiconductor package for vertical surface mounting'2004 6,773,955'Low profile multi-IC chip package connector'2004 6,765,803'Semiconductor device socket'2004 6,760,224'Heat sink with alignment and retaining features'2004 6,740,545'Adhesion enhanced semiconductor die for mold compound packaging'2004 6,738,263'Stackable ball grid array package'2004 6,734,529'Vertically mountable interposer and assembly'2004 6,709,893'Interconnections for a semiconductor device and method for forming same'2004 6,706,559'Method of attaching a leadframe to singulated semiconductor dice'2004 6,686,655'Low profile multi-IC chip package connector'2004 6,684,493'Vertically mountable interposer, assembly and method'2004 6,681,480'Method and apparatus for installing a circuit device'2004 6,670,702'Stackable ball grid array package'2003 6,670,550'Underfill coating for LOC package'2003 6,667,556'Flip chip adaptor package for bare die'2003 6,650,007'Stackable ceramic fbga for high thermal applications'2003 6,637,103'Method of tape bonding'2003 6,634,098'Methods for assembling, modifying and manufacturing a vertical surface mount package'2003 6,625,885'Method of making an electrical contact device'2003 6,611,058'Vertical surface mount assembly and methods'2003 6,589,810'BGA package and method of fabrication'2003 6,577,503'Vertical surface mount apparatus with thermal carrier'2003 6,563,217'Module assembly for stacked BGA packages'2003 6,558,966'Apparatus and methods of packaging and testing die'2003 6,552,427'BGA package and method of fabrication'2003 6,551,845'Method of temporarily securing a die to a burn-in carrier'2003 6,549,421'Stackable ball grid array package'2003 6,538,200'Underfill coating for LOC package'2003 6,538,463'Semiconductor die and retaining fixture'2003 6,537,100'Apparatus and method for packaging circuits'2003 6,531,764'Vertically mountable semiconductor device, assembly, and methods'2003 6,525,943'Heat sink with alignment and retaining features'2003 6,512,290'Vertically mountable and alignable semiconductor device, assembly, and methods'2003 6,512,302'Apparatus and methods of packaging and testing die'2003 6,511,863'Method and apparatus for a semiconductor package for vertical surface mounting'2003 6,512,303'Flip chip adaptor package for bare die'2003 6,506,628'Method of attaching a leadframe to singulated semiconductor dice'2003 6,506,625'Semiconductor package having stacked dice and leadframes and method of fabrication'2003 6,492,728'Vertical surface mount assembly'2002 6,489,186'Adhesion enhanced semiconductor die for mold compound packaging'2002 6,489,564'Stress relieving tape bonding interconnect'2002 6,486,546'Low profile multi-IC chip package connector'2002 6,485,778'Method of applying an adhesive material to lead fingers of a lead frame'2002 6,479,326'Heat sink for microchip application'2002 6,475,831'Methods for a low profile multi-IC chip package connector'2002 6,455,928'Stackable ball grid array package'2002 6,455,351'Vertical surface mount assembly and methods'2002 6,455,923'Apparatus and methods for providing substrate structures having metallic layers for microelectronics devices'2002 6,442,044'Semiconductor device socket, assembly and methods'2002 6,437,435'Vertically mountable interposer, assembly and method'2002 6,423,579'Apparatus and methods for providing substrate structures having metallic layers for microelectronics devices'2002 6,419,517'Apparatus and method for packaging circuits'2002 6,418,023'Vertical surface mount apparatus with thermal carrier'2002 6,414,391'Module assembly for stacked BGA packages with a common bus bar in the assembly'2002 6,414,374'Semiconductor device including edge bond pads and methods'2002 6,410,406'Semiconductor device including edge bond pads and methods'2002 6,408,509'Vertically mountable interposer, assembly and method'2002 6,384,333'Underfill coating for LOC package'2002 6,380,631'Apparatus and methods of packaging and testing die'2002 6,380,756'Burin carrier and semiconductor die assembly'2002 6,365,437'Method of connecting a die in an integrated circuit module'2002 6,362,429'Stress relieving tape bonding interconnect'2002 6,362,519'Low profile multi-IC chip package connector'2002 6,346,152'Method and apparatus for applying adhesives to a lead frame'2002 6,342,731'Vertically mountable semiconductor device, assembly, and methods'2002 6,336,973'Apparatus and method for modifying the configuration of an exposed surface of a viscous fluid'2002 6,331,939'Stackable ball grid array package'2001 6,329,709'Interconnections for a semiconductor device'2001 6,329,222'Interconnect for packaging semiconductor dice and fabricating BGA packages'2001 6,330,159'Vertical surface mount apparatus with thermal carrier'2001 6,326,242'Semiconductor package with heat sink and method of fabrication'2001 6,316,717'Heat sink for microchip application'2001 6,316,292'Adhesion enhanced semiconductor die for mold compound packaging'2001 6,312,977'Method of attaching a leadframe to singulated semiconductor dice'2001 6,310,390'BGA package and method of fabrication'2001 6,310,288'Underfill coating for loc package'2001 6,303,981'Semiconductor package having stacked dice and leadframes and method of fabrication'2001 6,297,548'Stackable ceramic FBGA for high thermal applications'2001 6,297,542'Connecting a die in an integrated circuit module'2001 6,297,546'Underfill coating for LOC package'2001 6,297,960'Heat sink with alignment and retaining features'2001 6,295,209'Semiconductor device including combed bond pad opening, assemblies and methods'2001 6,294,839'Apparatus and methods of packaging and testing die'2001 6,291,894'Method and apparatus for a semiconductor package for vertical surface mounting'2001 6,268,655'Semiconductor device including edge bond pads and methods'2001 6,268,649'Stackable ball grid array package'2001 6,265,766'Flip chip adaptor package for bare die'2001 6,265,773'Vertically mountable and alignable semiconductor device, assembly, and methods'2001 6,258,623'Low profile multi-IC chip package connector'2001 6,235,551'Semiconductor device including edge bond pads and methods'2001 6,232,666'Interconnect for packaging semiconductor dice and fabricating BGA packages'2001 6,232,146'Semiconductor device including combed bond pad opening, assemblies and methods'2001 6,228,677'Vertical surface mount assembly and methods'2001 6,225,689'Low profile multi-IC chip package connector'2001 6,215,183'Vertical surface mount assembly and methods'2001 6,201,304'Flip chip adaptor package for bare die'2001 6,200,833'Method of attaching a leadframe to singulated semiconductor dice'2001 6,198,636'Semiconductor device socket, assembly and methods'2001 6,191,474'Vertically mountable interposer assembly and method'2001 6,179,659'Electrical contact device and associated method of manufacture'2001 6,153,929'Low profile multi-IC package connector'2000 6,144,560'Semiconductor device including combed bond pad opening, assemblies and methods'2000 6,134,111'Vertical surface mount apparatus with thermal carrier'2000 6,115,254'Vertical surface mount apparatus with thermal carrier'2000 6,114,627'Underfill coating for LOC package'2000 6,095,822'Component module holder'2000 6,091,606'Semiconductor device including combed bond pad opening, assemblies and methods'2000 6,090,644'Underfill coating for LOC package'2000 6,087,723'Vertical surface mount assembly and methods'2000 6,088,237'Semiconductor device socket, assembly and methods'2000 6,088,238'Semiconductor device socket, assembly and methods'2000 6,072,233'Stackable ball grid array package'2000 6,066,514'Adhesion enhanced semiconductor die for mold compound packaging'2000 6,064,221'Method of temporarily securing a die to a burn-in carrier'2000 6,061,242'Die paddle heat sink with thermal posts'2000 6,049,125'Semiconductor package with heat sink and method of fabrication'2000 6,046,496'Chip package'2000 6,031,733'Preventing movement of integrated circuit packages relative to their support surface'2000 6,017,776'Method of attaching a leadframe to singulated semiconductor dice'2000 6,013,535'Method for applying adhesives to a lead frame'2000 5,995,378'Semiconductor device socket, assembly and methods'1999 5,960,258'Underfill coating for LOC package'1999 5,956,236'Integrated circuit package support system'1999 5,945,733'Structure for attaching a semiconductor wafer section to a support'1999 5,944,199'Integrated circuit package support system'1999 5,943,557'Method and structure for attaching a semiconductor die to a lead frame'1999 5,940,277'Semiconductor device including combed bond pad opening, assemblies and methods'1999 5,920,123'Multichip module assembly having via contacts and method of making the same'1999 5,895,222'Encapsulant dam standoff for shell-enclosed die assemblies'1999 5,894,167'Encapsulant dam standoff for shell-enclosed die assemblies'1999 5,760,468'Adhesion enhanced semiconductor die for mold compound packaging'1998 5,733,800'Underfill coating for LOC package'1998 5,719,440'Flip chip adaptor package for bare die'1998 5,656,551'Method for attaching a semiconductor die to a support'1997 5,583,372'Adhesion enhanced semiconductor die for mold compound packaging'1996 5,548,160'Method and structure for attaching a semiconductor die to a lead frame'1996 5,539,251'Tie bar over chip lead frame design'1996 5,304,842'Dissimilar adhesive die attach for semiconductor devices'1994 5,286,679'Method for attaching a semiconductor die to a leadframe using a patterned adhesive layer'1994 5,214,845'Method for producing high speed integrated circuits'1993 5,177,032'Method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tape'1993 5,140,404'Semiconductor device manufactured by a method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tape'1992

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1992–2018Patents assigned to MICRON TECHNOLOGY INC (185)· patent assignee history

1992–2018Based in Boise, ID, US· patent location history

1997–2012Based in Meridian, ID, US· patent location history

2001–2005Based in Meridien, ID, US· patent location history

2011–2012Patents assigned to ROUND ROCK RES LLC (8)· patent assignee history

2012Patents assigned to MODEN WALTER L (4)· patent assignee history

2012Patents assigned to BROOKS JERRY M (1)· patent assignee history

2012Patents assigned to CORISIS DAVID J (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
MICRON TECHNOLOGY INC	185	1992–2018
ROUND ROCK RES LLC	8	2011–2012
MODEN WALTER Lself	4	2012
BROOKS JERRY M	1	2012
CORISIS DAVID J	1	2012

Locations

Location	Patents	Span
Meridian, ID, US	166	1997–2012
Boise, ID, US	25	1992–2018
Meridien, ID, US	4	2001–2005