Inventor
Ryan Lei
Inventor
Hillsboro, OR, US
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1033%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
B23KSoldering or unsoldering13%
H10DInorganic electric semiconductor devices7%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests7%
Y10TTechnical subjects covered by former us classification7%
PatentTitleYear
7,279,369'Germanium on insulator fabrication via epitaxial germanium bonding'20077,211,890'Integrating thermoelectric elements into wafer for heat extraction'20077,161,224'Complete device layer transfer without edge exclusion via direct wafer bonding and constrained bond-strengthening process'20077,148,122'Bonding of substrates'20066,908,027'Complete device layer transfer without edge exclusion via direct wafer bonding and constrained bond-strengthening process'20056,833,195'Low temperature germanium transfer'2004Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2004–2007Patents assigned to INTEL CORP (6)· patent assignee history
2004–2007Based in Hillsboro, OR, US· patent location history
2007Based in Hillboro, OR, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 6 | 2004–2007 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hillsboro, OR, US | 5 | 2004–2007 |
| Hillboro, OR, US | 1 | 2007 |