Inventor
Nien-Fang Wu
Inventor
Chiayi, TW
Overview
Patents· 10 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1030%
H01LSemiconductor devices27%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1018%
H01QAntennas, i.e. radio aerials9%
H10DInorganic electric semiconductor devices6%
H01FMagnets3%
H01PWaveguides3%
Y10TTechnical subjects covered by former us classification3%
PatentTitleYear
11,056,438Semiconductor packages and method of forming the same202111,024,605Integrated circuit package and method202111,004,809Chip package with antenna element202110,937,719Package structure and method of fabricating the same202110,312,203Structure and formation method of chip package with antenna element201910,269,489Programmable inductor20199,728,477'Method of manufacturing a semiconductor device having scribe lines'20179,379,067'Semiconductor devices and methods of manufacture thereof having guard ring structure'20169,343,385'Semiconductor device comprising a chip substrate, a mold, and a buffer layer'20169,245,842'Semiconductor devices having guard ring structure and methods of manufacture thereof'2016Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2016Patents assigned to TAIWAN SEMICONDUCTOR MFG (3)· patent assignee history
2016–2021Based in Chiayi, TW· patent location history
2017–2021Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (7)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 7 | 2017–2021 |
| TAIWAN SEMICONDUCTOR MFG | 3 | 2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Chiayi, TW | 10 | 2016–2021 |