Inventor
Norimasa Nakamura
Inventor
Tokyo, JP
Overview
Patents· 19 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C08Lprimary
C08LCompositions of macromolecular compounds16%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds12%
Y10TTechnical subjects covered by former us classification10%
H05KPrinted circuits9%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients5%
C09JAdhesives5%
A61KPreparations for medical, dental or toiletry purposes3%
A61LMethods or apparatus for sterilising materials or objects in general3%
C07KPeptides3%
C08JWorking-up3%
PatentTitleYear
10,921,648Liquid crystal display device and polarizer protective film20219,694,107'Scaffold-free self-organized 3D synthetic tissue'20179,370,606'Scaffold-free self-organized 3D synthetic tissue'20167,368,493'Carbodiimide composition with suppressed yellowing, a stabilizer against hydrolysis and a thermoplastic resin composition'20087,361,701'Aliphatic polyester composition, a molded article thereof and a method for controlling biodegradation rate using the same composition'20086,846,860'Biodegradable plastic composition, a molded article thereof and a method for controlling biodegradation rate'20056,524,711'Thermosetting resin composition, and resin-covered metal foil, prepreg and film-shaped adhesive all using the composition'20036,485,833'Resin-coated metal foil'20026,440,258'Adhesive film for semiconductor package'20026,420,035'Metal material subjected to treatment for seizure prevention and method for production thereof'20026,387,505'Prepreg, multilayer printed wiring board and process for production of said multilayer printed wiring board'20026,331,226'LCP bonding method'20016,310,119'Film-shaped encapsulating agent for electronic parts'20016,225,417'One-pack type epoxy resin composition'20016,103,836'Epoxy resin composition'20006,090,906'Polycarbodiimide copolymer and process for production thereof'20005,650,476'Process for production of polycarbodiimide resin powder'19975,048,627'Fail-safe rear wheel steering system for vehicle'19914,878,217'Data outputting device'1989Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1989Based in Saitama, JP· patent location history
1991Based in Zama, JP· patent location history
1997–2008Patents assigned to NISSHIN SPINNING (14)· patent assignee history
1997–2021Based in Tokyo, JP· patent location history
2001–2008Based in Chiba, JP· patent location history
2016–2017Patents assigned to TWO CELLS CO LTD (2)· patent assignee history
2016Patents assigned to ANDO WATARU (1)· patent assignee history
2016Patents assigned to NAKAMURA NORIMASA (1)· patent assignee history
2016–2017Based in Nishinomiya, JP· patent location history
2021Patents assigned to DAINIPPON PRINTING CO LTD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NISSHIN SPINNING | 14 | 1997–2008 |
| TWO CELLS CO LTD | 2 | 2016–2017 |
| ANDO WATARU | 1 | 2016 |
| DAINIPPON PRINTING CO LTD | 1 | 2021 |
| NAKAMURA NORIMASAself | 1 | 2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 8 | 1997–2021 |
| Chiba, JP | 7 | 2001–2008 |
| Nishinomiya, JP | 2 | 2016–2017 |
| Zama, JP | 1 | 1991 |
| Saitama, JP | 1 | 1989 |