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Inventor

Tohru Mochida

Inventor
Tokyo, JP

Overview

1→
Patents
1991
Patent span
Performing operations
Primary field (CPC B)

Patents· 1 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B23Kprimary
B23KSoldering or unsoldering50%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
PatentTitleYear
5,058,797'Detection method for wire bonding failures'1991

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1991Patents assigned to SHINKAWA KK (1)· patent assignee history
1991Based in Tokyo, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SHINKAWA KK11991
Locations
LocationPatentsSpan
Tokyo, JP11991