Inventor
Jeffrey Alan Miks
Inventor
Chandler, AZ, US
Overview
Patents· 31 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
G06KGraphical data reading16%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%
H05KPrinted circuits5%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation5%
B81BMicrostructural devices or systems, e.g. micromechanical devices3%
B82YSpecific uses or applications of nanostructures3%
G11CStatic stores3%
B23KSoldering or unsoldering2%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems2%
PatentTitleYear
9,367,712'High density memory card using folded flex'20168,618,619'Top port with interposer MEMS microphone package and method'20138,445,984'Micro-optical device packaging system'20138,018,072'Semiconductor package having a heat spreader with an exposed exterion surface and a top mold gate'20117,960,827'Thermal via heat spreader package and method'20117,556,986'Tape supported memory card leadframe structure'20097,485,952'Drop resistant bumpers for fully molded memory cards'20097,485,491'Secure digital memory card using land grid array structure'20097,358,600'Interposer for interconnecting components in a memory card'20087,293,716'Secure digital memory card using land grid array structure'20077,193,305'Memory card ESC substrate insert'20077,176,062'Lead-frame method and assembly for interconnecting circuits within a circuit module'20077,112,875'Secure digital memory card using land grid array structure'20067,102,214'Pre-molded leadframe'20067,102,891'Circuit module having interconnects for connecting functioning and non-functioning add ons and method therefor'20067,095,103'Leadframe based memory card'20067,074,654'Tape supported memory card leadframe structure'20067,019,387'Lead-frame connector and circuit module assembly'20067,011,251'Die down multi-media card and method of making same'20066,998,702'Front edge chamfer feature for fully-molded memory cards'20066,965,159'Reinforced lead-frame assembly for interconnecting circuits within a circuit module'20056,919,620'Compact flash memory card with clamshell leadframe'20056,910,635'Die down multi-media card and method of making same'20056,900,527'Lead-frame method and assembly for interconnecting circuits within a circuit module'20056,798,046'Semiconductor package including ring structure connected to leads with vertically downset inner ends'20046,798,047'Pre-molded leadframe'20046,717,822'Lead-frame method and circuit module assembly including edge stiffener'20046,201,186'Electronic component assembly and method of making the same'20016,139,079'Universal transport apparatus'20006,103,548'Semiconductor device and method of manufacture'20005,903,051'Electronic component and method of manufacture'1999Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1999–2001Patents assigned to MOTOROLA INC (4)· patent assignee history
1999–2016Based in Chandler, AZ, US· patent location history
2004–2016Patents assigned to AMKOR TECHNOLOGY INC (27)· patent assignee history
2013–2016Patents assigned to MIKS JEFFREY ALAN (3)· patent assignee history
2013Patents assigned to CROWLEY SEAN TIMOTHY (1)· patent assignee history
2013Patents assigned to HASKETT BRADLEY MORGAN (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| AMKOR TECHNOLOGY INC | 27 | 2004–2016 |
| MOTOROLA INC | 4 | 1999–2001 |
| MIKS JEFFREY ALANself | 3 | 2013–2016 |
| CROWLEY SEAN TIMOTHY | 1 | 2013 |
| HASKETT BRADLEY MORGAN | 1 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Chandler, AZ, US | 31 | 1999–2016 |