Inventor
Kuniaki Mamitsu
Inventor
Okazaki, JP
Overview
Patents· 29 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1070%
H01LSemiconductor devices13%
H05KPrinted circuits8%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems3%
H03KPulse technique3%
H10DInorganic electric semiconductor devices3%
Y10TTechnical subjects covered by former us classification3%
PatentTitleYear
10,079,226Semiconductor device20189,070,666'Semiconductor device including cooler'20158,963,315'Semiconductor device with surface electrodes'20158,957,517'Semiconductor device including cooler'20158,884,426'Semiconductor device including cooler'20148,558,375'Semiconductor package cooled by grounded cooler'20138,547,697'Fixing structure and fixing method of circuit board with embedded electronic parts to cooler'20138,497,572'Semiconductor module and method of manufacturing the same'20138,441,122'Semiconductor device having semiconductor chip and metal plate'20138,278,747'Semiconductor apparatus having a two-side heat radiation structure'20128,125,781'Semiconductor device'20127,957,135'Semiconductor module'20117,944,045'Semiconductor module molded by resin with heat radiation plate opened outside from mold'20117,728,413'Resin mold type semiconductor device'20107,573,687'Power semiconductor device'20097,470,939'Semiconductor device'20087,345,369'Semiconductor device having semiconductor chip on base through solder layer and method for manufacturing the same'20087,239,016'Semiconductor device having heat radiation plate and bonding member'20077,235,876'Semiconductor device having metallic plate with groove'20077,145,254'Transfer-molded power device and method for manufacturing transfer-molded power device'20067,091,603'Semiconductor device'20066,992,383'Semiconductor device having radiation structure'20066,967,404'Semiconductor device having radiation structure'20056,960,825'Semiconductor device having radiation structure'20056,891,265'Semiconductor device having radiation structure'20056,803,667'Semiconductor device having a protective film'20046,798,062'Semiconductor device having radiation structure'20046,703,707'Semiconductor device having radiation structure'20046,693,350'Semiconductor device having radiation structure and method for manufacturing semiconductor device having radiation structure'2004Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2004–2018Patents assigned to DENSO CORP (29)· patent assignee history
2004–2018Based in Okazaki, JP· patent location history
2004–2015Based in Nukata-gun, JP· patent location history
2012–2018Patents assigned to MAMITSU KUNIAKI (8)· patent assignee history
2012–2018Patents assigned to TESHIMA TAKANORI (4)· patent assignee history
2012–2013Patents assigned to FUJII TETSUO (2)· patent assignee history
2013Patents assigned to NISHIHATA MASAYOSHI (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| DENSO CORP | 29 | 2004–2018 |
| MAMITSU KUNIAKIself | 8 | 2012–2018 |
| TESHIMA TAKANORI | 4 | 2012–2018 |
| NISHIHATA MASAYOSHI | 3 | 2013 |
| FUJII TETSUO | 2 | 2012–2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Okazaki, JP | 15 | 2004–2018 |
| Nukata-gun, JP | 14 | 2004–2015 |