Inventor
Alexander Heilmaier
Inventor
Haiming, DE
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1040%
B24BMachines, devices, or processes for grinding or polishing33%
H01LSemiconductor devices13%
B28DWorking stone or stone-like materials7%
C09KMaterials for miscellaneous applications, not provided for elsewhere7%
PatentTitleYear
10,189,142Method for polishing a semiconductor wafer20199,221,149'Method for polishing semiconductor wafers by means of simultaneous double-side polishing'20158,242,020'Method for producing a semiconductor wafer'20127,766,724'Method for simultaneously slicing at least two cylindrical workpieces into a multiplicity of wafers'20107,108,583'Method for removing material from a semiconductor wafer'20066,861,360'Double-sided polishing process for producing a multiplicity of silicon semiconductor wafers'2005Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2005–2019Patents assigned to SILTRONIC AG (6)· patent assignee history
2005Based in Marktl, DE· patent location history
2006–2019Based in Haiming, DE· patent location history
2012Patents assigned to HEIER GERHARD (1)· patent assignee history
2012Patents assigned to HEILMAIER ALEXANDER (1)· patent assignee history
2012Patents assigned to ROETTGER KLAUS (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SILTRONIC AG | 6 | 2005–2019 |
| HEIER GERHARD | 1 | 2012 |
| HEILMAIER ALEXANDERself | 1 | 2012 |
| ROETTGER KLAUS | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Haiming, DE | 5 | 2006–2019 |
| Marktl, DE | 1 | 2005 |