Inventor

Koji Fujisaki

Inventor
Hitachi, JP

Overview

19→
Patents
1987–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 19 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1016%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1011%
C09GPolishing compositions9%
C09KMaterials for miscellaneous applications, not provided for elsewhere9%
H01LSemiconductor devices9%
B24BMachines, devices, or processes for grinding or polishing6%
H05KPrinted circuits6%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds5%
Y10TTechnical subjects covered by former us classification5%
C01BNon-metallic elements3%
PatentTitleYear
10,737,937Sensor characteristic evaluation method and charged particle beam device202010,557,059Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrate202010,557,058Polishing agent, polishing agent set, and substrate polishing method202010,549,399Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrate202010,196,542Abrasive, abrasive set, and method for abrading substrate20199,932,497Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrate20189,490,328'Silicon carbide semiconductor device and manufacturing method of the same'20169,346,978'Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrate'20169,346,977'Abrasive, abrasive set, and method for abrading substrate'20169,163,162'Polishing agent, polishing agent set and method for polishing base'20155,570,506'Method for forming multilayer wiring construction'19965,208,066'Process of forming a patterned polyimide film and articles including such a film'19935,183,838'Acid anhydride complex and process for producing same, and composition containing same'19935,133,989'Process for producing metal-polyimide composite article'19924,792,476'Low thermal expansion resin material and composite shaped article'19884,759,958'Method for forming polyimide film by chemical vapor deposition'19884,760,126'Fluorine-containing polyamide-acid derivative and polyimide'19884,758,875'Resin encapsulated semiconductor device'19884,690,999'Low thermal expansion resin material and composite shaped article'1987

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1987–2020Patents assigned to HITACHI CHEMICAL CO LTD (13)· patent assignee history
1987–2020Patents assigned to HITACHI LTD (11)· patent assignee history
1987–1996Based in Hitachi, JP· patent location history
2015–2020Based in Kokubunji, JP· patent location history
2016–2020Based in Tokyo, JP· patent location history
2020Patents assigned to HITACHI CHEMCIAL COMPANY LTD (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
HITACHI CHEMICAL CO LTD131987–2020
HITACHI LTD111987–2020
HITACHI CHEMCIAL COMPANY LTD12020
Locations
LocationPatentsSpan
Hitachi, JP91987–1996
Kokubunji, JP82015–2020
Tokyo, JP22016–2020