Inventor

NAN GUO

Inventor

CN

Overview

2021–2025

Patent span

Electricity

Primary field (CPC H)

Patents· 51 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H04Nprimary

H04NPictorial communication, e.g. television22%

H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation12%

G02BOptical elements, systems or apparatus11%

H01LSemiconductor devices10%

G03BApparatus or arrangements for taking photographs or for projecting or viewing them9%

H05KPrinted circuits9%

H04MTelephonic communication4%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h104%

B29CShaping or joining of plastics3%

B29LIndexing scheme associated with subclass b29c, relating to particular articles3%

PatentTitleYear

12,298,533Manufacturing method of a molded photosensitive assembly for an array imaging module2025 12,231,759Split lens and camera module and electronic apparatus2025 12,189,358Monitoring method for vibration drilling state of stack structure material2025 12,189,202Split lens assembly and camera module2025 12,189,209Lens assembly, camera module and method for assembling same2025 12,119,361Circuit board assembly with photosensitive element mounted to back side of circuit board2024 12,105,350Adjustable optical lens and camera module and manufacturing method and applications thereof2024 12,068,344Molding photosensitive assembly, and camera module and electronic device containing molding photosensitive assembly2024 12,041,335Camera module, circuit board assembly and manufacturing method thereof, and electronic device with camera module2024 12,035,029Camera module and array camera module based on integral packaging technology2024 12,022,180Array camera module and application thereof2024 11,881,491Camera module, photosensitive component, photosensitive-component joined panel, and forming die thereof and manufacturing method thereof2024 11,874,518Camera lens module and manufacturing method thereof2024 11,874,584Lens module and capturing module integrating focusing mechanism and assembly method therefor2024 11,877,044Integral packaging process-based camera module, integral base component of same, and manufacturing method thereof2024 11,867,965Adjustable optical lens and camera module and manufacturing method thereof2024 11,835,784Adjustable optical lens and camera module and aligning method thereof2023 11,822,099Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device2023 11,824,071Camera module and molded photosensitive assembly and manufacturing method thereof, and electronic device2023 11,785,325Camera module having circuit board, molded base, and optical lens, electronic device having same and method for manufacturing camera module2023 11,728,368Semiconductor packaging method and semiconductor device based on molding process2023 11,729,483Photosensitive component, and camera module and manufacturing method therefor2023 11,721,709Circuit board assembly with photosensitive element mounted to back side of circuit board2023 11,703,654Camera lens module and manufacturing method thereof2023 11,664,397Camera module, photosensitive component, photosensitive-component joined panel, and forming die thereof and manufacturing method thereof2023 11,659,263Split lens and camera module and electronic apparatus2023 11,652,132Systems and methods for manufacturing semiconductor modules2023 11,653,079Camera module, circuit board assembly and manufacturing method thereof, and electronic device with camera module2023 11,627,239Photosensitive assembly and camera module and manufacturing method thereof2023 11,601,576Array camera module having height difference, circuit board assembly and manufacturing method therefor, and electronic device2023 11,575,816Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof2023 11,570,336System-level camera module with electrical support and manufacturing method thereof2023 11,533,416Camera module and array camera module based on integral packaging technology2022 11,480,754Multi-group lens assembly, camera module and assembly method thereof, and electronic device2022 11,477,354Camera module and molded circuit board assembly and manufacturing method thereof2022 11,451,693Camera module and molding circuit board assembly, circuit board and application thereof2022 11,435,545Camera lens module and manufacturing method thereof2022 11,393,862Manufacture of semiconductor module with dual molding2022 11,394,861Camera module, manufacturing method thereof and corresponding intelligent terminal2022 11,385,432Camera lens module and manufacturing method thereof2022 11,388,320Photosensitive component, and camera module and manufacturing method therefor2022 11,378,722Optical lens head, camera module and assembling method therefor2022 11,363,184Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof2022 11,315,967Camera module, photosensitive component, photosensitive-component joined panel, and forming die thereof and manufacturing method thereof2022 11,289,521Camera module and molded photosensitive assembly and manufacturing method therefor, and electronic device2022 11,277,564Method for compensating for image quality of optical system by means of lens adjustment2022 11,233,079Camera module and molded circuit board assembly thereof, array camera module and electronic device2022 11,223,751Photosensitive assembly and camera module and manufacturing method thereof2022 11,165,941Array camera module and application thereof2021 11,163,216Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device2021 11,139,328Manufacture of semiconductor module with transparent molding component2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2025Patents assigned to NINGBO SUNNY OPOTECH CO LTD (49)· patent assignee history

2021Patents assigned to SUNNY OPOTECH NORTH AMERICA INC (1)· patent assignee history

2021–2025Based in CN· patent location history

2025Patents assigned to UNIV NANJING AERONAUTICS & ASTRONAUTICS (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
NINGBO SUNNY OPOTECH CO LTD	49	2021–2025
SUNNY OPOTECH NORTH AMERICA INC	1	2021
UNIV NANJING AERONAUTICS & ASTRONAUTICS	1	2025

Locations

Location	Patents	Span
CN	51	2021–2025