Inventor
Mitsuhiro Tomikawa
Inventor
Ogaki, JP
Overview
Patents· 24 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits28%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
H01LSemiconductor devices17%
H01GCapacitors11%
Y10TTechnical subjects covered by former us classification6%
H10DInorganic electric semiconductor devices5%
Y02PClimate change mitigation technologies in the production or processing of goods5%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h103%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation2%
PatentTitleYear
11,114,249Thin-film capacitor202110,950,389Thin-film capacitor202110,886,219Electronic component mounting package202110,813,220Electronic component embedded substrate202010,483,345Electronic component embedded substrate201910,340,088Thin-film capacitor201910,278,290Electronic component embedded substrate201910,211,157Electronic component201910,143,092Circuit substrate and method for manufacturing the same20189,955,591Circuit substrate and method for manufacturing the same20189,930,791'Wiring board with built-in electronic component and method for manufacturing the same'20189,872,401'Circuit substrate and method for manufacturing the same'20189,831,163Circuit substrate and method for manufacturing the same20179,743,534'Wiring board with built-in electronic component and method for manufacturing the same'20179,433,097'Circuit substrate and method for manufacturing the same'20169,332,657'Multilayer printed wiring board and method for manufacturing multilayer printed wiring board'20169,232,656'Wiring board and method for manufacturing the same'20169,204,552'Printed wiring board'20158,891,245'Printed wiring board'20148,829,357'Wiring board and method for manufacturing the same'20148,698,269'Wiring board with built-in imaging device and method for manufacturing same'20148,693,209'Wiring board and method for manufacturing the same'20145,245,158'Semiconductor device manufacturing apparatus'19935,187,558'Stress reduction structure for a resin sealed semiconductor device'1993Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1993Based in Itami, JP· patent location history
1993Based in Hyogo, JP· patent location history
2014–2018Patents assigned to IBIDEN CO LTD (14)· patent assignee history
2014–2016Patents assigned to TOMIKAWA MITSUHIRO (5)· patent assignee history
2014–2016Patents assigned to MIKADO YUKINOBU (4)· patent assignee history
2014–2016Patents assigned to FURUTANI TOSHIKI (3)· patent assignee history
2014–2018Based in Ogaki, JP· patent location history
2019–2021Patents assigned to TDK CORP (8)· patent assignee history
2019–2021Based in Tokyo, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBIDEN CO LTD | 14 | 2014–2018 |
| TDK CORP | 8 | 2019–2021 |
| TOMIKAWA MITSUHIROself | 5 | 2014–2016 |
| MIKADO YUKINOBU | 4 | 2014–2016 |
| FURUTANI TOSHIKI | 3 | 2014–2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Ogaki, JP | 14 | 2014–2018 |
| Tokyo, JP | 8 | 2019–2021 |
| Itami, JP | 1 | 1993 |
| Hyogo, JP | 1 | 1993 |