Inventor

Yoshiaki Wakashima

Inventor

Kawasaki, JP

Overview

16→

Patents

1976–2004

Patent span

Electricity

Primary field (CPC H)

Patents· 16 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1030%

H05KPrinted circuits13%

G11CStatic stores11%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h109%

Y10TTechnical subjects covered by former us classification9%

H10BElectronic memory devices7%

H10DInorganic electric semiconductor devices4%

B29BPreparation or pretreatment of the material to be shaped2%

B29CShaping or joining of plastics2%

B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts2%

PatentTitleYear

6,708,398'Substrate for use in package of semiconductor device, semiconductor package using the substrate, and methods for manufacturing the substrate and the semiconductor package'2004 6,492,203'Semiconductor device and method of fabrication thereof'2002 6,268,648'Board for mounting semiconductor element, method for manufacturing the same, and semiconductor device'2001 5,910,685'Semiconductor memory module having double-sided stacked memory chip layout'1999 5,334,875'Stacked semiconductor memory device and semiconductor memory module containing the same'1994 5,198,888'Semiconductor stacked device'1993 5,028,986'Semiconductor device and semiconductor module with a plurality of stacked semiconductor devices'1991 4,982,265'Semiconductor integrated circuit device and method of manufacturing the same'1991 4,977,441'Semiconductor device and tape carrier'1990 4,792,532'Semiconductor device and process for producing the same, and tape carrier used in said process'1988 4,523,371'Method of fabricating a resin mold type semiconductor device'1985 4,494,217'Semiconductor memories with .alpha. shield'1985 4,322,593'Apparatus for pre-heating resin tablet'1982 4,064,289'Method of making a semiconductor device'1977 3,946,427'Semiconductor device'1976 3,939,488'Method of manufacturing semiconductor device and resulting product'1976

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1976–1999Patents assigned to HITACHI LTD (12)· patent assignee history

1976–2004Based in Kawasaki, JP· patent location history

1985–2004Patents assigned to HITACHI CHEMICAL CO LTD (4)· patent assignee history

1985Based in Kanagawa, JP· patent location history

1991–1999Patents assigned to HITACHI TOBU SEMICONDUCTOR LTD (4)· patent assignee history

1991–1999Patents assigned to AKITA ELECTRONICS CO LTD (2)· patent assignee history

1991Patents assigned to HITACHITOBU SEMICONDUCTOR LTD (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
HITACHI LTD	12	1976–1999
HITACHI CHEMICAL CO LTD	4	1985–2004
HITACHI TOBU SEMICONDUCTOR LTD	4	1991–1999
AKITA ELECTRONICS CO LTD	2	1991–1999
HITACHITOBU SEMICONDUCTOR LTD	1	1991

Locations

Location	Patents	Span
Kawasaki, JP	15	1976–2004
Kanagawa, JP	1	1985