Inventor
Heike Marcello
Inventor
Brackney, PA, US
Overview
Patents· 10 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits38%
Y10TTechnical subjects covered by former us classification27%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices15%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1015%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%
PatentTitleYear
6,835,533'Photoimageable dielectric epoxy resin system film'20046,706,464'Method of fabricating circuitized structures'20046,680,440'Circuitized structures produced by the methods of electroless plating'20046,528,218'Method of fabricating circuitized structures'20036,519,843'Method of forming a chip carrier by joining a laminate layer and stiffener'20036,376,158'Methods for selectively filling apertures'20026,195,264'Laminate substrate having joining layer of photoimageable material'20016,066,889'Methods of selectively filling apertures'20006,025,057'Organic electronic package and method of applying palladium-tin seed layer thereto'20005,866,237'Organic electronic package and method of applying palladium-tin seed layer thereto'1999Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1999–2004Patents assigned to IBM (10)· patent assignee history
1999–2004Based in Brackney, PA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 10 | 1999–2004 |
Locations
| Location | Patents | Span |
|---|---|---|
| Brackney, Pennsylvania, US | 10 | 1999–2004 |