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Inventor

Matthew R. Walsh

Inventor
Sharpsville, IN, US

Overview

18→
Patents
2003–2020
Patent span
Physics
Primary field (CPC G)

Patents· 18 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary
H05KPrinted circuits9%
Y10TTechnical subjects covered by former us classification8%
G06FElectric digital data processing7%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h107%
F41AFunctional features or details common to both smallarms and ordnance, e.g. cannons6%
F41HArmour6%
F41JTargets6%
G01MTesting static or dynamic balance of machines or structures6%
G01NInvestigating or analysing materials by determining their chemical or physical properties6%
G06TImage data processing or generation, in general6%
PatentTitleYear
10,721,262Resource-centric network cyber attack warning system20209,772,818'Event detection system having multiple sensor systems in cooperation with an impact detection system'20179,430,189'Vehicle damage detection system and method of manufacturing the same'20169,235,378'Vehicle damage detection system and method of manufacturing the same'20169,081,409'Event detection control system for operating a remote sensor or projectile system'20158,977,507'Event detection system user interface system coupled to multiple sensors including an impact detection system'20158,788,220'Vehicle damage detection system'20148,788,218'Event detection system having multiple sensor systems in cooperation with an impact detection system'20147,855,685'Microwave communication package'20107,422,448'Surface mount connector'20087,268,429'Technique for manufacturing an overmolded electronic assembly'20077,202,571'Electronic module with form in-place pedestal'20076,999,317'Thermally enhanced electronic module with self-aligning heat sink'20066,943,058'No-flow underfill process and material therefor'20056,916,684'Wafer-applied underfill process'20056,833,628'Mutli-chip module'20046,802,446'Conductive adhesive material with metallurgically-bonded conductive particles'20046,660,560'No-flow underfill material and underfill method for flip chip devices'2003

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2003–2010Patents assigned to DELPHI TECH INC (10)· patent assignee history
2003–2010Based in Sharpsville, IN, US· patent location history
2014–2017Patents assigned to US NAVY (7)· patent assignee history
2014–2015Patents assigned to SCOTT ERIC B (4)· patent assignee history
2014–2015Patents assigned to SOLES ALEXANDER M (4)· patent assignee history
2014–2015Patents assigned to WALSH MATTHEW R (4)· patent assignee history
2014–2017Based in Westfield, IN, US· patent location history
2020Based in New York, NY, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
DELPHI TECH INC102003–2010
US NAVY72014–2017
SCOTT ERIC B42014–2015
SOLES ALEXANDER M42014–2015
WALSH MATTHEW Rself42014–2015
Locations
LocationPatentsSpan
Sharpsville, IN, US102003–2010
Westfield, IN, US72014–2017
New York, New York, US12020