Inventor
Kun-Che Pai
Inventor
Taichung, TW
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B24Bprimary
B24BMachines, devices, or processes for grinding or polishing60%
B24DTools for grinding, buffing or sharpening40%
PatentTitleYear
10,828,745Polishing pad and polishing method202010,421,173Base layer, polishing pad with base layer, and polishing method201910,239,182Polishing pad and polishing method20199,969,049Polishing layer of polishing pad and method of forming the same and polishing method20189,707,662'Method of manufacturing polishing pad having detection window and polishing pad having detection window'20178,609,001'Method of manufacturing polishing pad having detection window'2013Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2013Patents assigned to IV TECHNOLOGIES CO LTD (1)· patent assignee history
2013Patents assigned to LI SHIUAN-TZUNG (1)· patent assignee history
2013Patents assigned to PAI KUN-CHE (1)· patent assignee history
2013Patents assigned to WANG CHAO-CHIN (1)· patent assignee history
2013–2020Based in Taichung, TW· patent location history
2017–2020Patents assigned to IV TECH CO LTD (5)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IV TECH CO LTD | 5 | 2017–2020 |
| IV TECHNOLOGIES CO LTD | 1 | 2013 |
| LI SHIUAN-TZUNG | 1 | 2013 |
| PAI KUN-CHEself | 1 | 2013 |
| WANG CHAO-CHIN | 1 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Taichung, TW | 6 | 2013–2020 |