Inventor
YUUKI ABURAKAWA
Inventor
JP
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Gprimary
H01GCapacitors30%
H05KPrinted circuits30%
H01LSemiconductor devices20%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
PatentTitleYear
11,676,767Thin film capacitor having a dielectric layer having a through hole whose inner surface has first and second tapered surfaces, circuit board incorporating the same, and thin film capacitor manufacturing method202311,430,611Thin film capacitor, circuit board incorporating the same, and thin film capacitor manufacturing method202211,398,354Thin film capacitor, manufacturing method therefor, and substrate with built-in electronic component202211,240,908Thin film capacitor and circuit board incorporating the same2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2023Patents assigned to TDK CORP (4)· patent assignee history
2022–2023Based in JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TDK CORP | 4 | 2022–2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 4 | 2022–2023 |