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Inventor

QIONG ZHAN

Inventor
CN

Overview

3→
Patents
2023–2025
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices22%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1022%
G01NInvestigating or analysing materials by determining their chemical or physical properties11%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices11%
G11CStatic stores11%
H10BElectronic memory devices11%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
PatentTitleYear
12,322,445Three dimensional semiconductor memory structure202512,322,707Large die wafer, large die and method of forming the same202511,804,458Method of fabricating integrated circuit device2023

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2023–2025Patents assigned to WUHAN XINXIN SEMICONDUCTOR MFG (3)· patent assignee history
2023–2025Based in CN· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
WUHAN XINXIN SEMICONDUCTOR MFG32023–2025
Locations
LocationPatentsSpan
CN32023–2025