Inventor
DONGMING HE
Inventor
US
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices39%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1039%
H10BElectronic memory devices9%
G02BOptical elements, systems or apparatus4%
G11CStatic stores4%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
PatentTitleYear
12,564,107Package comprising optical integrated device202612,500,188Flip-chip bumping metal layer and bump structure202512,113,038Thermal compression flip chip bump for high performance and fine pitch202411,948,909Package comprising spacers between integrated devices202411,721,656Integrated device comprising pillar interconnect with cavity202311,694,982Sidewall wetting barrier for conductive pillars202311,557,557Flip-chip flexible under bump metallization size202311,437,335Integrated circuit (IC) packages employing a thermal conductive package substrate with die region split, and related fabrication methods202211,417,622Flip-chip device2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to QUALCOMM INC (9)· patent assignee history
2022–2026Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| QUALCOMM INC | 9 | 2022–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 9 | 2022–2026 |