Inventor
YI-JU CHEN
Inventor
TW
Overview
Patents· 20 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices19%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
H10DInorganic electric semiconductor devices15%
H04WWireless communication networks10%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
G01RMeasuring electric variables4%
G11CStatic stores4%
H04LTransmission of digital information, e.g. telegraphic communication4%
Y02DClimate change mitigation technologies in information and communication technologies [ict], i.e. information and communication technologies aiming at the reduction of their own energy use4%
A47FSpecial furniture, fittings, or accessories for shops, storehouses, bars, restaurants or the like2%
PatentTitleYear
12,568,523Configuration for UE energy consumption reduction features202612,556,956Beam-based radio resource management measurement relaxation202612,395,302Coreset enhancement for reduced bandwidth UEs initial access202512,323,846Methods for enabling a low bandwidth wireless device to access a new radio cell via a wideband control resource set202512,272,642Benchmark device on a semiconductor wafer with fuse element202512,267,797NR timing advance change detection202512,154,856Methods of manufacturing via structures on source/drain contacts202412,074,218Contact structure with insulating cap202411,883,418Compound TSYI-ZAC for inhibiting dengue virus infection and medicinal use thereof202411,876,024Method for operating a benchmark device on a semiconductor wafer with fuse element202411,876,044Method for activating backup unit through fuse element202411,843,030Fuse elements and semiconductor devices202311,747,394Probe apparatus with a track202311,685,584Hardware merchandise carrying device202311,668,745Probe apparatus having a track and wafer inspection method using the same202311,594,658Flip-chip light emitting diode with two flat pads202311,545,432Semiconductor device with source and drain vias having different sizes202311,241,157Upper gastrointestinal bleeding monitoring system202211,244,950Method for preparing a memory device202211,139,203Using mask layers to facilitate the formation of self-aligned contacts and vias2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2024Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (4)· patent assignee history
2021–2025Based in TW· patent location history
2022–2025Patents assigned to NANYA TECHNOLOGY CORP (7)· patent assignee history
2022Patents assigned to MEDIVISIONTECH CO LTD (1)· patent assignee history
2023Patents assigned to LEXTAR ELECTRONICS CORP (1)· patent assignee history
2025–2026Patents assigned to ERICSSON TELEFON AB L M (5)· patent assignee history
2025–2026Based in SE· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NANYA TECHNOLOGY CORP | 7 | 2022–2025 |
| ERICSSON TELEFON AB L M | 5 | 2025–2026 |
| TAIWAN SEMICONDUCTOR MFG CO LTD | 4 | 2021–2024 |
| LEXTAR ELECTRONICS CORP | 1 | 2023 |
| MEDIVISIONTECH CO LTD | 1 | 2022 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 15 | 2021–2025 |
| SE | 5 | 2025–2026 |