Inventor
Ashwinkumar C. Bhatt
Inventor
Endicott, NY, US
Overview
Patents· 29 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits33%
Y10TTechnical subjects covered by former us classification22%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices8%
G01NInvestigating or analysing materials by determining their chemical or physical properties7%
H01JElectric discharge tubes or discharge lamps3%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests3%
B24BMachines, devices, or processes for grinding or polishing2%
C23FNon-mechanical removal of metallic material from surface2%
G06QInformation and communication technology [ict] specially adapted for administrative, commercial, financial, managerial or supervisory purposes2%
PatentTitleYear
8,493,173'Method of cavity forming on a buried resistor layer using a fusion bonding process'20137,801,833'Item identification control method'20107,596,863'Method of providing a printed circuit board with an edge connection portion and/or a plurality of cavities therein'20097,510,324'Method of inspecting articles using imaging inspection apparatus with directional cooling'20097,490,984'Method of making an imaging inspection apparatus with improved cooling'20097,354,197'Imaging inspection apparatus with improved cooling'20087,261,466'Imaging inspection apparatus with directional cooling'20076,887,651'Electrodeposited photoresist and dry film photoresist photolithography process for printed circuit board patterning'20056,740,819'Printed wiring board'20046,608,757'Method for making a printed wiring board'20036,426,565'Electronic package and method of making same'20026,274,291'Method of reducing defects in I/C card and resulting card'20016,162,365'Pd etch mask for copper circuitization'20006,127,097'Photoresist develop and strip solvent compositions and method for their use'20006,093,335'Method of surface finishes for eliminating surface irregularities and defects'20006,038,137'Chip carrier having a chip mounted on an organic dielectric substrate overlaid with a photoimageable dielectric having circuitry thereon'20006,009,620'Method of making a printed circuit board having filled holes'20005,922,517'Method of preparing a substrate surface for conformal plating'19995,905,018'Method of preparing a substrate surface for conformal plating'19995,827,386'Method for forming a multi-layered circuitized substrate member'19985,817,405'Circuitized substrate with same surface conductors of different resolutions'19985,798,909'Single-tiered organic chip carriers for wire bond-type chips'19985,724,232'Chip carrier having an organic photopatternable material and a metal substrate'19985,707,893'Method of making a circuitized substrate using two different metallization processes'19985,599,747'Method of making circuitized substrate'19975,578,796'Apparatus for laminating and circuitizing substrates having openings therein'19965,566,448'Method of construction for multi-tiered cavities used in laminate carriers'19965,542,175'Method of laminating and circuitizing substrates having openings therein'19965,268,260'Photoresist develop and strip solvent compositions and method for their use'1993Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1993–2005Patents assigned to IBM (22)· patent assignee history
1993–2013Based in Endicott, NY, US· patent location history
2007–2013Patents assigned to ENDICOTT INTERCONNECT TECH INC (7)· patent assignee history
2013Patents assigned to BHATT ASHWINKUMAR C (1)· patent assignee history
2013Patents assigned to BUCHTER CHARLES (1)· patent assignee history
2013Patents assigned to CARD NORMAN A (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 22 | 1993–2005 |
| ENDICOTT INTERCONNECT TECH INC | 7 | 2007–2013 |
| BHATT ASHWINKUMAR Cself | 1 | 2013 |
| BUCHTER CHARLES | 1 | 2013 |
| CARD NORMAN A | 1 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Endicott, New York, US | 29 | 1993–2013 |