Inventor
Shigekazu Saito
Inventor
Osaka, JP
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C08Lprimary
C08LCompositions of macromolecular compounds21%
C09JAdhesives21%
Y10TTechnical subjects covered by former us classification21%
B65HHandling thin or filamentary material, e.g. sheets, webs, cables7%
F01LCyclically operating valves for machines or engines7%
G03GElectrography7%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems7%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h107%
PatentTitleYear
11,084,682Sheet processing apparatus and image forming system202110,370,567Hot melt adhesive20199,816,014'Hot melt adhesive for disposable products'20179,695,340'Low temperature hot melt adhesive for high-speed coating and spiral coating'20176,906,935'Inverter apparatus and method of manufacturing the same'20055,960,754'Valve operating system in internal combustion engine'1999Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1999–2005Patents assigned to HONDA MOTOR CO LTD (2)· patent assignee history
1999Based in Saitama, JP· patent location history
2005Based in Wako, JP· patent location history
2017–2019Patents assigned to HENKEL AG & CO KGAA (3)· patent assignee history
2017–2019Based in Osaka, JP· patent location history
2021Patents assigned to FURUHASHI TOMOHIRO (1)· patent assignee history
2021Patents assigned to HOSHINO TOMOMICHI (1)· patent assignee history
2021Patents assigned to RICOH CO LTD (1)· patent assignee history
2021Based in Yokohama-shi, Kanagawa, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HENKEL AG & CO KGAA | 3 | 2017–2019 |
| HONDA MOTOR CO LTD | 2 | 1999–2005 |
| FURUHASHI TOMOHIRO | 1 | 2021 |
| HOSHINO TOMOMICHI | 1 | 2021 |
| RICOH CO LTD | 1 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Osaka, JP | 3 | 2017–2019 |
| Yokohama-shi, Kanagawa, JP | 1 | 2021 |
| Wako, JP | 1 | 2005 |
| Saitama, JP | 1 | 1999 |