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Inventor

Huai-Jen Hsu

Inventor
Hsinchu, TW

Overview

3→
Patents
2004–2005
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1040%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices20%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%
Y10TTechnical subjects covered by former us classification20%
PatentTitleYear
6,927,345'Guard ring having electrically isolated lightening bars'20056,709,965'Aluminum-copper bond pad design and method of fabrication'20046,677,228'Reinforced aluminum copper bonding pad'2004

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2004–2005Patents assigned to TAIWAN SEMICONDUCTOR MFG (3)· patent assignee history
2004–2005Based in Hsinchu, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAIWAN SEMICONDUCTOR MFG32004–2005
Locations
LocationPatentsSpan
Hsinchu, TW32004–2005