Inventor
Choong Kooi Chee
Inventor
Penang, MY
Overview
Patents· 15 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1041%
H01LSemiconductor devices16%
H05KPrinted circuits13%
Y10TTechnical subjects covered by former us classification13%
F15CFluid-circuit elements predominantly used for computing or control purposes6%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests6%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h103%
Y02PClimate change mitigation technologies in the production or processing of goods3%
PatentTitleYear
11,107,751Face-to-face through-silicon via multi-chip semiconductor apparatus with redistribution layer packaging and methods of assembling same202110,136,516Microelectronic device attachment on a reverse microelectronic package20189,978,735Interconnection of an embedded die20189,699,904'Microelectronic device attachment on a reverse microelectronic package'20179,159,714'Package on wide I/O silicon'20158,835,220'Backside mold process for ultra thin substrate and package on package assembly'20148,384,223'Backside mold process for ultra thin substrate and package on package assembly'20137,453,622'Micro-electromechanical system (mems) polyelectrolyte gel network pump'20087,339,276'Underfilling process in a molded matrix array package using flow front modifying solder resist'20087,262,077'Capillary underfill and mold encapsulation method and apparatus'20077,212,332'Micro-electromechanical system (MEMS) polyelectrolyte gel network pump'20077,151,014'Underfilling process in a molded matrix array package using flow front modifying solder resist'20067,088,010'Chip packaging compositions, packages and systems made therewith, and methods of making same'20067,005,321'Stress-compensation layers in contact arrays, and processes of making same'20066,774,471'Protected bond fingers'2004Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2004–2021Patents assigned to INTEL CORP (14)· patent assignee history
2004–2021Based in Penang, MY· patent location history
2013–2017Patents assigned to CHEE CHOONG KOOI (2)· patent assignee history
2013Patents assigned to LIEW KEIN FEE (1)· patent assignee history
2015–2018Based in Balik Pulau, MY· patent location history
2017Patents assigned to LOO HOWE YIN (1)· patent assignee history
2018Patents assigned to ALTERA CORP (1)· patent assignee history
2018Based in Georgetown, MY· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 14 | 2004–2021 |
| CHEE CHOONG KOOIself | 2 | 2013–2017 |
| ALTERA CORP | 1 | 2018 |
| LIEW KEIN FEE | 1 | 2013 |
| LOO HOWE YIN | 1 | 2017 |
Locations
| Location | Patents | Span |
|---|---|---|
| Penang, MY | 11 | 2004–2021 |
| Balik Pulau, MY | 3 | 2015–2018 |
| Georgetown, MY | 1 | 2018 |