Inventor
JASPREET S. GANDHI
Inventor
US
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices45%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1045%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h109%
PatentTitleYear
12,033,980Thermal pads between stacked semiconductor dies and associated systems and methods202411,776,877Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths202311,688,664Semiconductor device assembly with through-mold cooling channel formed in encapsulant202311,594,462Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods202311,139,258Bonding pads with thermal pathways2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2024Patents assigned to MICRON TECHNOLOGY INC (5)· patent assignee history
2021–2024Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MICRON TECHNOLOGY INC | 5 | 2021–2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 5 | 2021–2024 |