LexDanaLexDanabeta
Inventor

Yoshiaki Yamada

Inventor
Tokyo, JP

Overview

102→
Patents
1982–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 102 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1012%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h108%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests8%
B41JTypewriters6%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices5%
Y02TClimate change mitigation technologies related to transportation5%
B60LPropulsion of electrically-propelled vehicles5%
B60KArrangement or mounting of propulsion units or of transmissions in vehicles3%
H04JMultiplex communication3%
G01NInvestigating or analysing materials by determining their chemical or physical properties3%
PatentTitleYear
11,132,168Display method, display device, and display program202110,651,944Optical transmitter, optical receiver, optical data transmission system, optical transmission method, and optical reception method202010,249,589Semiconductor device including conductive layer and conductive pillar disposed on conductive layer and method of manufacturing the same201910,250,348Optical transport system and resource optimization method201910,230,457Framer and framing method201910,200,116Multi-lane transmission device and multi-lane transmission method201910,193,566Encoding/decoding system for parallel data201910,181,921Framer and framing method201910,122,462Transport apparatus and transport method201810,063,321Framer, optical transmission device, and framing method20189,973,270Multi-lane transmission device and multi-lane transmission method20189,831,671Power supply device20179,627,999'Power supply device'20179,520,806'Power supply device for supplying power to a load by combining a secondary battery and a capacitor'20169,490,710'Power supply device for supplying power to a load by combining a secondary battery and a capacitor'20168,961,351'Continuously variable transmission'20158,889,337'Film forming method, film forming apparatus and pattern forming method'20148,770,327'Accessory drive mechanism for hybrid vehicle'20148,702,370'Substrate transfer method for performing processes including photolithography sequence'20148,585,523'Power transmitting mechanism for hybrid vehicle'20138,430,777'Power transmission mechanism for parallel hybrid vehicle'20138,420,303'Substrate processing method, computer-readable storage medium and substrate processing system'20138,376,637'Photoresist coating and developing apparatus, substrate transfer method and interface apparatus'20138,236,132'Substrate processing system and substrate transfer method'20128,133,663'Pattern forming method and apparatus'20128,007,968'Substrate processing method, program, computer-readable storage medium and substrate processing system'20117,901,149'Substrate processing method, program, computer-readable recording medium, and substrate processing system'20117,826,032'Circulation system for high refractive index liquid in pattern forming apparatus'20107,667,794'Color element-equipped substrate, method for manufacturing color element-equipped substrate, and electronic device'20107,651,285'Edge exposure apparatus, coating and developing apparatus, edge exposure method and coating and developing method, and storage medium'20107,625,597'Method for producing a color filter, apparatus for manufacturing a color filter, electrooptic apparatus, and electronic device'20097,510,272'Apparatus and method of assembling head unit, of positioning liquid droplet ejection head, and of fixing liquid droplet ejection head; as well as method of manufacturing LCD device, organic EL device, electron emission device, PDP device, electrophoretic display device, color filter, organic EL, spacer, metallic wire, lens, resist, and light diffusion member'20097,455,389'Ejecting method and ejecting apparatus'20087,384,126'Liquid drop discharge head, discharge method and discharge device; electro optical device, method of manufacture thereof, and device for manufacture thereof; color filter, method of manufacture thereof, and device for manufacture thereof; and device incorporating backing, method of manufacture thereof, and device for manufacture thereof'20087,378,790'Color display substrate, color filter substrate, color luminescent substrate, manufacturing method of color display substrate, electro-optical apparatus, electronic device, film-forming method, film-forming apparatus, and display motherboard'20087,322,394'Apparatus and method of assembling head unit and of fixing liquid droplet ejection head'2008D0557332'Ink jet liquid injector'20077,116,348'Member to be recognized for alignment; head unit and electronic device provided therewith; method of manufacturing LCD, organic EL device, electron emission device, PDP device, electrophoretic display device, color filter, and organic EL; method of forming spacer, metallic wire, lens, resist, and light diffusion member, each of said methods using said head unit'20067,101,440'Ejecting method and ejecting apparatus'20067,087,276'Thermal transfer recording medium, thermal transfer recording method and recorded article'20067,052,099'Liquid drop ejecting device and liquid drop ejecting method, layer forming device and layer forming method, manufacturing for device, and electronic apparatus'20067,040,741'Apparatus and method of assembling head unit, of positioning liquid droplet ejection head, and of fixing liquid droplet ejection head; as well as method of manufacturing LCD device, organic EL device, electron emission device, PDP device, electrophoretic display device, color filter, organic EL, spacer, metallic wire, lens, resist, and light diffusion member'20067,036,906'Liquid droplet ejection apparatus, method of manufacturing electrooptic device, electrooptic device and electronic device'20067,032,990'Liquid droplet ejection apparatus, method of manufacturing electrooptic device, electrooptic device, and electronic device'20066,995,969'Electric double-layer capacitor'2006D0514618'Ink jet liquid injector'20066,991,315'Ejecting method and ejecting apparatus'20066,959,502'Drying apparatus and workpiece processing apparatus having the same'20056,948,795'Ejection device, manufacturing device of color filter substrate, manufacturing device of electro-luminescent display device, manufacturing device of plasma display device, and ejection method'20056,933,958'MEMBER TO BE RECOGNIZED FOR ALIGNMENT; HEAD UNIT AND ELECTRONIC DEVICE PROVIDED THEREWITH; METHOD OF MANUFACTURING LCD, ORGANIC EL DEVICE, ELECTRON EMISSION DEVICE, PDP DEVICE, ELECTROPHORETIC DISPLAY DEVICE, COLOR FILTER, AND ORGANIC EL; METHOD OF FORMING SPACER, METALLIC WIRE, LENS, RESIST, AND LIGHT DIFFUSION MEMBER, EACH OF SAID METHODS USING SAID HEAD UNIT'20056,922,185'Inputting device and electronic instrument using this inputting device and inputting method thereof'20056,921,148'LIQUID DROP DISCHARGE HEAD, DISCHARGE METHOD AND DISCHARGE DEVICE; ELECTRO OPTICAL DEVICE, METHOD OF MANUFACTURE THEREOF, AND DEVICE FOR MANUFACTURE THEREOF; COLOR FILTER, METHOD OF MANUFACTURE THEREOF, AND DEVICE FOR MANUFACTURE THEREOF; AND DEVICE INCORPORATING BACKING, METHOD OF MANUFACTURE THEREOF, AND DEVICE FOR MANUFACTURE THEREOF'20056,866,356'System and methods for providing a head drive unit'20056,787,913'Ohmic contact plug having an improved crack free TiN barrier metal in a contact hole and method of forming the same'20046,777,912'Power source system for driving vehicle'20046,661,108'Hybrid drive device'20036,627,996'Semiconductor device having fluorine containing silicon oxide layer as dielectric for wiring pattern having anti-reflective layer and insulating layer thereon'20036,524,218'Auxiliary machinery driver for car'20036,449,530'Semiconductor wafer carrier, semiconductor wafer carrier automatic transfer system and method for producing a semiconductor device'20026,440,828'Process of fabricating semiconductor device having low-resistive contact without high temperature heat treatment'20026,395,456'Semiconductor device achieving higher integration, method of manufacturing thereof, and method of forming resist pattern used therefor'20026,353,786'Braking device for an electrically-powered car that uses a load of an electrical motor as a braking force'20026,344,411'OHMIC contact plug having an improved crack free tin barrier metal in a contact hole and method of forming the same'20026,328,122'Hybrid vehicle comprising emergency drive device'20016,313,536'Semicoductor device having a multilayered interconnection structure'20016,287,956'Multilevel interconnecting structure in semiconductor device and method of forming the same'20016,255,225'Method of forming a resist pattern, a method of manufacturing semiconductor device by the same method, and a device and a hot plate for forming a resist pattern'20016,250,767'Light guide plate, surface light source and display using the same'20016,241,857'Method of depositing film and sputtering apparatus'20016,241,859'Method of forming a self-aligned refractory metal silicide layer'20016,217,319'Semiconductor manufacturing device and method of processing wafer'20016,159,756'Method of testing semiconductor device'20006,130,154'Semiconductor device and fabrication process thereof'20006,127,267'Fabrication method of semiconductor device equipped with silicide layer'20006,122,049'Liquid chromatographic apparatus'20006,117,562'Thermal image transfer recording medium'20006,107,190'Method of fabricating semiconductor device'20006,106,782'Chromatograph'20006,093,637'Method of making a multi-layer interconnection structure'20006,058,764'Analytical apparatus, liquid chromatography analyzer and a method therefor'20005,997,398'Semiconductor wafer storage apparatus and semiconductor device fabricating apparatus using said apparatus'19995,910,020'Method for fabricating a semiconductor device having a refractory metal pillar for electrical connection'19995,900,645'Semiconductor device and method of testing the same'19995,889,801'Driving method for tunable semiconductor laser diode, tunable light source device and driving method for the same'19995,827,778'Method of manufacturing a semiconductor device using a silicon fluoride oxide film'19985,811,666'Apparatus and method for chromatographic analysis using pressure changes to identify the sample'19985,804,505'Method of producing semiconductor device having buried contact structure'19985,744,016'Sputtering apparatus'19985,716,477'Thermal image transfer recording medium and recording method using the same'19985,661,558'Optical detector for flowing sample and optical detection method for flowing sample'19975,643,422'Reactive sputtering system for depositing titanium nitride without formation of titanium nitride on titanium target and process of depositing titanium nitride layer'19975,571,001'Electrically-powered water-immersed pump'19965,543,357'Process of manufacturing a semiconductor device by filling a via hole in an interlayered film of the device with wiring metal'19965,512,170'Liquid chromatograph'19965,470,792'Method of manufacturing semiconductor device'19955,470,392'Semiconductor device processing method'19955,383,482'Semiconductor processing apparatus and module'19955,238,874'Fabrication method for laminated films comprising Al-Si-Co alloy film and refractory metal silioide copper film'19935,129,790'Plunger pump'19925,058,473'Veneer clipper'19914,732,067'Veneer clipper'19884,316,758'Apparatus of manufacturing plywood'1982

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1993–2005Patents assigned to NEC CORP (22)· patent assignee history
1993–2014Based in Tokyo, JP· patent location history
1999–2020Patents assigned to NIPPON TELEGRAPH & TELEPHONE (10)· patent assignee history
2001–2013Based in Ageo, JP· patent location history
2005–2021Patents assigned to SEIKO EPSON CORP (22)· patent assignee history
2005–2010Based in Suwa, JP· patent location history
2010–2014Patents assigned to TOKYO ELECTRON LTD (10)· patent assignee history
2012–2015Patents assigned to YAMADA YOSHIAKI (10)· patent assignee history
2016–2017Based in Saitama, JP· patent location history
2018–2020Based in Yokosuka, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
NEC CORP221993–2005
SEIKO EPSON CORP222005–2021
NIPPON TELEGRAPH & TELEPHONE101999–2020
TOKYO ELECTRON LTD102010–2014
YAMADA YOSHIAKIself102012–2015
Locations
LocationPatentsSpan
Tokyo, JP311993–2014
Suwa, JP192005–2010
Yokosuka, JP92018–2020
Ageo, JP82001–2013
Saitama, JP42016–2017