Inventor
John R. Fraley
Inventor
Fayetteville, AR, US
Overview
Patents· 17 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G01Kprimary
G01KMeasuring temperature16%
F01DNon-positive displacement machines or engines, e.g. steam turbines9%
H03FAmplifiers9%
H04QSelecting9%
F05DIndexing scheme for aspects relating to non-positive-displacement machines or engines, gas-turbines or jet-propulsion plants8%
G01DMeasuring not specially adapted for a specific variable8%
G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure6%
H05KPrinted circuits6%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h105%
Y10TTechnical subjects covered by former us classification5%
PatentTitleYear
9,615,452'Silver filled trench substrate for high power and/or high temperature electronics'20179,435,819'Autonomous temperature accelerometer sensor'20169,118,289'High temperature magnetic amplifiers'20159,071,888'Instrumented component for wireless telemetry'20158,952,674'Voltage regulator circuitry operable in a high temperature environment of a turbine engine'20158,803,703'Electronic circuitry for high-temperature environments'20148,797,179'Instrumented component for wireless telemetry'20148,766,720'Hybrid load differential amplifier operable in a high temperature environment of a turbine engine'20148,717,095'Chopper circuitry operable in a high temperature environment of a turbine engine'20148,629,783'Wireless telemetry electronic circuitry for measuring strain in high-temperature environments'20148,525,036'Wireless telemetry electronic circuit board for high temperature environments'20138,519,866'Wireless telemetry for instrumented component'20138,458,899'Method for manufacturing a circuit for high temperature and high g-force environments'20138,220,990'Wireless telemetry electronic circuit package for high temperature environments'20128,223,036'Wireless telemetry electronic circuitry for measuring strain in high-temperature environments'20128,092,080'Wireless telemetry circuit structure for measuring temperature in high temperature environments'20128,023,269'Wireless telemetry electronic circuit board for high temperature environments'2011Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2011–2015Patents assigned to SIEMENS ENERGY INC (12)· patent assignee history
2011–2017Patents assigned to ARKANSAS POWER ELECTRONICS INT INC (11)· patent assignee history
2011–2017Based in Fayetteville, AR, US· patent location history
2012–2015Patents assigned to FRALEY JOHN R (12)· patent assignee history
2012–2015Patents assigned to MITCHELL DAVID J (12)· patent assignee history
2012–2015Patents assigned to KULKARNI ANAND A (9)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| FRALEY JOHN Rself | 12 | 2012–2015 |
| MITCHELL DAVID J | 12 | 2012–2015 |
| SIEMENS ENERGY INC | 12 | 2011–2015 |
| ARKANSAS POWER ELECTRONICS INT INC | 11 | 2011–2017 |
| KULKARNI ANAND A | 9 | 2012–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Fayetteville, AR, US | 17 | 2011–2017 |