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Inventor

HOW KIAT LIEW

Inventor
MY

Overview

3→
Patents
2022–2024
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices30%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1030%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1030%
H10DInorganic electric semiconductor devices10%
PatentTitleYear
11,942,369Thin semiconductor package for notched semiconductor die202411,791,297Molded semiconductor package and related methods202311,244,918Molded semiconductor package and related methods2022

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022–2024Patents assigned to SEMICONDUCTOR COMPONENTS IND LLC (3)· patent assignee history
2022–2024Based in MY· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SEMICONDUCTOR COMPONENTS IND LLC32022–2024
Locations
LocationPatentsSpan
MY32022–2024