Inventor
Tzer-Perng Chen
Inventor
Hsinchu, TW
Overview
Patents· 58 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Hprimary
H10HInorganic light-emitting semiconductor devices having potential barriers48%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
H01LSemiconductor devices13%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
B82YSpecific uses or applications of nanostructures3%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation3%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution3%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests2%
C30BSingle-crystal growth1%
F21KNon-electric light sources using luminescence1%
PatentTitleYear
10,686,106Optoelectronic element202010,529,898Optoelectronic element202010,319,886LED assembly for omnidirectional light appliances20199,947,839LED assembly20189,893,244'Optoelectronic element'20189,741,905'Optoelectronic element'20179,559,229'Multi-junction solar cell'20179,546,762'LED assembly'20179,502,622'LED assembly'20169,362,456'Optoelectronic semiconductor device'20169,142,740'Optoelectronic element and manufacturing method thereof'20159,024,451'Integrated lighting apparatus and method of manufacturing the same'20159,018,655'Light emitting apparatus and manufacture method thereof'20159,000,461'Optoelectronic element and manufacturing method thereof'20158,816,386'Light emitting device and manufacture method thereof'20148,816,508'Integrated lighting apparatus having a control device and method of manufacturing the same'2014RE044429'Light-emitting semiconductor device having enhanced brightness'20138,274,156'Optoelectronic semiconductor device'20128,049,226'Light-emitting device'20118,022,425'Semiconductor device'20117,335,926'Package structure for light emitting diode and method thereof'20087,335,522'Package structure for light emitting diode and method thereof'20087,067,340'Flip-chip light emitting diode and fabricating method thereof'20067,037,741'Compound semiconductor optoelectronic device'20067,030,423'Package structure for light emitting diode and method thereof'20067,018,859'Method of fabricating AlGaInP light-emitting diode and structure thereof'20067,012,281'Light emitting diode device and manufacturing method'20066,984,852'Package structure for light emitting diode and method thereof'20066,921,924'Semiconductor light-emitting device'20056,869,820'High efficiency light emitting diode and method of making the same'20056,861,677'Package of lightemitting diode with protective element'20056,812,067'Method for integrating compound semiconductor with substrate or high thermal conductivity'20046,797,987'High efficiency light emitting diode and method of making the same'20046,786,390'LED stack manufacturing method and its structure thereof'20046,781,160'Semiconductor light emitting device and method for manufacturing the same'20046,762,069'Method for manufacturing light-emitting element on non-transparent substrate'20046,709,883'Light emitting diode and method of making the same'20046,693,306'Structure of a light emitting diode and method of making the same'20046,682,950'Light emitting diode and method of making the same'20046,661,028'Interface texturing for light-emitting device'20036,649,437'Method of manufacturing high-power light emitting diodes'20036,599,768'Surface mounting method for high power light emitting diode'20036,586,875'Light emitting diode with low-temperature solder layer'20036,583,443'Light emitting diode and method of making the same'20036,552,369'Light emitting diode and fabricating method thereof'20036,489,250'Method for cutting group III nitride semiconductor light emitting element'20026,458,612'Method of fabricating high efficiency light-emitting diode with a transparent substrate'20026,455,343'Method of manufacturing light emitting diode with current blocking structure'20026,429,460'Highly luminous light emitting device'20026,410,348'Interface texturing for light-emitting device'20026,380,564'Semiconductor light emitting device'20026,319,778'Method of making light emitting diode'20016,066,862'High brightness light emitting diode'20005,944,410'Structure of a laser indicator'19995,661,742'Light emitting diode structure'19975,565,694'Light emitting diode with current blocking layer'19965,300,791'Light emitting diode'19944,902,376'Modified horizontal bridgman method for growing GaAs single crystal'1990Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1990–2020Based in Hsinchu, TW· patent location history
2000–2006Patents assigned to UNITED EPITAXY CO LTD (23)· patent assignee history
2002Based in Hsin Chu, TW· patent location history
2006–2020Patents assigned to EPISTAR CORP (23)· patent assignee history
2012–2017Patents assigned to CHEN TZER-PERNG (5)· patent assignee history
2016–2019Patents assigned to HUGA OPTOTECH INC (4)· patent assignee history
2016–2019Patents assigned to INTERLIGHT OPTOTECH CORP (4)· patent assignee history
2016–2019Based in Yangmei Taoyuan, TW· patent location history
2017Based in Taoyuan County, TW· patent location history
2020Based in Hs, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| EPISTAR CORP | 23 | 2006–2020 |
| UNITED EPITAXY CO LTD | 23 | 2000–2006 |
| CHEN TZER-PERNGself | 5 | 2012–2017 |
| HUGA OPTOTECH INC | 4 | 2016–2019 |
| INTERLIGHT OPTOTECH CORP | 4 | 2016–2019 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu, TW | 51 | 1990–2020 |
| Yangmei Taoyuan, TW | 3 | 2016–2019 |
| Hs, TW | 1 | 2020 |
| Taoyuan County, TW | 1 | 2017 |
| Hsin Chu, TW | 1 | 2002 |